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Référence fabricant
PIC16F1708T-I/ML
PIC16F Series 7 KB Flash 512 B RAM 32 MHz 8-Bit Microcontroller - QFN-20
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3300 par Reel | ||||||||||
| Code de date: | |||||||||||
Microchip PIC16F1708T-I/ML - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change: This qualification was initially performed to qualify Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 16L, 20L and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change: Microchip has decided to not qualify Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 16L, 20L and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.November 06, 2023: Issued initial notification.March 08, 2024: Reissued initial notification. Updated the affected parts list. Updated the mold compound from CEL-400ZHF40-PLM2KG to X8511AU-IMP1 (1st mold) / X8511CUB-AP1 (2nd mold), and EME-QXG01 (1st & 2nd mold), and updated die attach from BSP 140 to BSP 1100 in the pre- and post- change summary table. Updated the estimated qualification completion date to be on March 2024.March 15, 2024: Reissued initial notification to update the Qual Plan file name.April 16, 2024: Issued final notification. Added estimated first ship date on May 01, 2024 and updated qual report completion on May 31, 2024. Updated the affected CPN list to add newly released parts. Updated post change mold compound material to NEPL Proprietary.December 10, 2024: Re-issued final notification. Attached the qualification report. Updated the affected CPN list to add newly released parts. Removed CPNs PIC18F16Q20-I/REBC01 and PIC18F16Q20TI/REBC01 on the affected parts list due to being EOL'd. Removed 16L QFN (4x4x0.9mm) package and included 20L VQFN (4x4x1.0mm) package in the Notification subject.March 12, 2025: Issued cancellation notice.
Description of Change: Qualification of MPHL as an additional final test site for selected PIC16F1708, PIC16F785, PIC16F18346, PIC16F15345, PIC16F1704, PIC16F1824, PIC16F1783, PIC16F18345, PIC16F18325, PIC16F18326 andPIC16F15325 device families available in various packages.Reason for Change: To improve productivity and on-time delivery performance by qualifying MPHL as an additional final test site.
PCN Status:Final NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 16L, 20L and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change:To improve Productivity, Manufacturability, and Cycle Time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:01 May 2024 (date code: 2418)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Revision History:November 06, 2023: Issued initial notification.March 08, 2024: Reissued initial notification. Updated the affected parts list. Updated the mold compound from CEL-400ZHF40-PLM2KG to X8511AU-IMP1 (1st mold) / X8511CUB-AP1 (2nd mold), and EME-QXG01 (1st & 2nd mold), and updated die attach from BSP 140 to BSP 1100 in the pre- and post- change summary table. Updated the estimated qualification completion date to be on March 2024.March 15, 2024: Reissued initial notification to update the Qual Plan file name.April 16, 2024: Issued final notification. Added estimated first ship date on May 01, 2024 and updated qual report completion on May 31, 2024. Updated the affected CPN list to add newly released parts. Updated post change mold compound material to NEPL Proprietary.Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 16L and 20L QFN (4x4x0.9mm), 16L and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change:To improve Productivity, Manufacturability, and Cycle Time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 16L QFN and 20L QFN (4x4x0.9mm), 16L VQFN and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L QFN and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change:To improve Productivity, Manufacturability, and Cycle Time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 16L QFN and 20L QFN (4x4x0.9mm), 16L VQFN and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L QFN and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change:To improve Productivity, Manufacturability, and Cycle Time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 20L VQFN and 16L QFN (3x3x0.9mm), 16L QFN and 20L QFN (4x4x0.9mm), 16L VQFN and 28L VQFN (4x4x1.0mm), 40L VQFN, 40L QFN and 20L QFN (5x5x0.9mm) packages at NEPL assembly site.Reason for Change:To improve Productivity, Manufacturability, and Cycle Time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel