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Amphenol Communications Solutions | DILB40P-223TLF

Codice produttore

DILB40P-223TLF

40 Position (2 x 20 ) 2.54 mm Pitch Open Frame Through Hole DIP Socket

Modello ECAD:
Fabbricante: Amphenol Communications Solutions
Confezione Standard:
Product Variant Information section
Codice data: 2429
Product Specification Section
Amphenol Communications Solutions DILB40P-223TLF - Caratteristiche Tecniche
Attributes Table
Type: DIP Socket
Style: PCB Through Hole
No of Pins: 40
Termination Style/Mounting: Solder
Terminal Pitch: 2.54mm
Contact Material: Copper Alloy
Contact Plating: Tin
Rated Current: 1A
Material: Polyamide
Insulation Resistance: 1000MΩ
Operating Temp Range: -55°C to +105°C
No of Rows: 2
Dielectric Withstanding Voltage: 1000V
Metodo di montaggio: Through Hole
Pricing Section
Stock globale:
132
Germania:
132
In ordine:
0
Stock in fabbrica:Stock in fabbrica:
0
Lead Time del produttore:
10 Weeks
Ordine minimo:
12
Multiplo di:
12
Totale
9,06 $
USD
Quantità
Prezzo unitario
12
0,755 $
60
0,73 $
240
0,705 $
600
0,69 $
1.500+
0,665 $
Product Variant Information section