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Référence fabricant
23K256-E/SN
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100 par Tube
SOIC-8
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for 23A256-I/SN, 23A256T-I/SN, 23A640-I/SN, 23A640T-I/SN, 23K256-E/SN, 23K256-I/SN, 23K256T-E/SN, 23K256T-I/SN, 23K640-E/SN, 23K640-I/SN, 23K640T-E/SN and 23K640T-I/SN catalog part numbers (CPN) available in 8L SOIC (3.90mm) package at MTAI assembly site.Pre and Post Summary Changes: See attched SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional wire material and QMI519 as a new die attach material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: September 2026
Microchip has released a new Datasheet for the 23A256/23K256 - 256-Kbit SPI Bus Low-Power Serial SRAM of devices. If you are using one of these devices please read the document located at 23A256/23K256 - 256-Kbit SPI Bus Low-Power Serial SRAM.Notification Status: FinalDescription of Change: Updated section 2.1: ?Principles of Operation?.Impacts to Data Sheet: See above detailsReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 13 Oct 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
