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PIC32CM6408JH00032-E/RTB
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490 par Tray
VQFN-32
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change: Microchip has released a new Document for the PIC32CM32/64 JH00 Family Silicon Errata and Data Sheet Clarifications of devices.Added a note to the OSC48M Start-Up errataReason for Change: To Improve ProductivityDate Document Changes Effective: 07 Sep 2026
Description of Change: Qualification of MTAI as an additional assembly site for selectedATSAMC20E1x, ATSAMC21E1x, ATSAMD20E1x, ATSAMD21E1x, ATSAMDA1E1x, ATSAML10E1x, ATSAML11E1x, PIC32CM1216JH0xx, PIC32CM1216LExx, PIC32CM1216LSxx, PIC32CM1216MCxx, PIC32CM1602GVxx, PIC32CM3204GVxx, PIC32CM3204JHxx, PIC32CM6408JHxx, PIC32CM6408MCxx device families available in 32L VQFN (5x5x1mm) wettable flank package.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional assembly site.Change Implementation Status: In ProgressEstimated First Ship Date: 26 June 2026 (date code: 2626)
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology for selected ATSAMC20E15A, ATSAMC20E16A, ATSAMC20E17A, ATSAMC20E18A, ATSAMC21E15A, ATSAMC21E16A, ATSAMC21E17A, ATSAMC21E18A, PIC32CM3204JH00032 and PIC32CM6408JH00032 device families available in 32L VQFN (5x5x1mm) and 32L VQFN-WFS (5x5x1mm) packages at MP3A assembly site.Reason for Change: To improve productivity, manufacturability and cycle time by qualifying panel level package (PLP) packaging technology at MP3A assembly site.
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
****FPCN115312/FPCN114582 UPDATE/MATERIAL CHANGE*****Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATSAMD21xx, ATSAMC21xx, ATSAMC20xx, ATSAMDA1xx, ATSAMD20xx, ATSAML22xx, ATSAML21xx, PIC32CM2xx, PIC32CM1xx, PIC32CM3xx, PIC32CM6xx, ATSAML10xx,ATSAML11xx and PIC32CM5xx device families available in 32L and 48L VQFN (5x5x1mm and 7x7x0.9mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium-coated copper with gold flash (CuPdAu) bond wire as an additional wire material.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
