Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Pays sélectionné
Référence fabricant
TLE4253EXUMA2
Tèlèchargez les modèles CAD pour ce produit. En savoir plus sur SnapMagic.
2500 par Reel
DSO-8
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Subject: Introduction of copper wire bond for dedicated DOPL4_8 products.Description:PROCESS - ASSEMBLY: Change of wire bondingOld 25 Cu Bonding Wire.New 30 Cu Bonding WireReason:Copper wire bonding is part of Infineon’s continuous drive to deliver higher performance products. A copper wire enables superior electrical, thermal and reliability performance compared to gold, making it an excellent interconnect solution for automotive packaging.Anticipated impact of change:Based on the qualification performed, Infineon does not see any negative impact on quality, function and reliability. No change in fit, form, function.Intended start of delivery 2026-09-30
Description:Old:Products are tested on one or two of the below mentioned sites: Infineon Technologies AG, Regensburg, Germany. Infineon Technologies AG, Villach, Austria.Infineon Technologies Dresden GmbH & Co. KG, Dresden, Germany.Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia.New:Products are tested on all of the below mentioned sites: Infineon Technologies AG, Regensburg, Germany AND Infineon Technologies AG, Villach, Austria AND Infineon Technologies Dresden GmbH & Co. KG, Dresden, Germany AND Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia AND Infineon Technologies Manufacturing (Thailand), Samut Prakan, Thailand (BKK).Reason:Capacity expansion of wafer test within Infineon test cluster locations to assure continuity of supply and enable flexible manufacturing.
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
