Manufacturer Part #
PIC16F1826-I/SO
PIC16F Series 3.5 kB Flash 256 B RAM 32 MHz 8-Bit Microcontroller - SOIC-18
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:42 per Tube Package Style:SOIC-18 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2424 | ||||||||||
Microchip PIC16F1826-I/SO - Product Specification
Shipping Information:
ECCN:
PCN Information:
Final Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 200K wafer technology available in 18L SOIC packageDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 200K wafer technology available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 200K wafer technology available in 18L SOIC packageDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 200K wafer technology available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Part Status:
Microchip PIC16F1826-I/SO - Technical Attributes
| Family Name: | PIC16F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 3.5kB |
| RAM Size: | 256B |
| Speed: | 32MHz |
| No of I/O Lines: | 16 |
| InterfaceType / Connectivity: | I2C/SPI/USART |
| Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/USART/Watchdog |
| Number Of Timers: | 3 |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 12-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | SOIC-18 |
| Mounting Method: | Surface Mount |
Features & Applications
Features:
- Enhanced Mid-range Core with 49 Instruction, 16 Stack Levels
- Flash Program Memory with self read/write capability
- Internal 32 MHz oscillator
- Integrated Capacitive mTouch Sensing Module
- Data Signal Modulator Module
- MI2C, SPI, EUSART w/auto baud
- ECCP (Enhanced/Capture Compare PWM) Module
- Comparators with selectable Voltage Reference
- 8 Channel 10b ADC with Voltage Reference
- 25mA Source/Sink current I/O
- Two 8-bit Timers (TMR0/TMR2)
- One 16-bit Timer (TMR1)
- Extended Watchdog Timer (EWDT)
- Enhanced Power-On/Off-Reset
- Brown-Out Reset (BOR)
- In Circuit Serial Programming (ICSP)
- On Board In-Circuit Debug
- Wide Operating Voltage (1.8 V – 5.5 V)
- Low Power PIC16LF182x variants (1.8 V – 3.6 V)
- Standby Current (PIC16LF182X): 20 nA @ 1.8 V, typical
- Active Current(PIC12LF1823): 50 uA/MHz @ 1.8 V, typical
Available Packaging
Package Qty:
42 per Tube
Package Style:
SOIC-18
Mounting Method:
Surface Mount
