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Manufacturer Part #
PIC16F18877-I/PT
PIC16F Series 56 kB Flash 4096 B RAM 36 I/O SMT 8-Bit Microcontroller - TQFP-44
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray Package Style:TQFP-44 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC16F18877-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected PIC16F1537x, PIC16F1887x, PIC16F1917x, PIC16F1919x, PIC18F44Q71, PIC18F45K4x, PIC18F45Qxx, PIC18F46K4x, PIC18F46Qxx, PIC18F47K4x, PIC18F47Qxx, PIC18F65K40, PIC18F66K40 and PIC18F67K40 device families available in 44L and 64L TQFP (10x10x1mm) packages.Reason for Change: To improve manufacturability CuPdAu as a new wire material and QMI519 as a new die attach material.Estimated First Ship Date: 30 May 2025 (date code: 2522)
Part Status:
Microchip PIC16F18877-I/PT - Technical Attributes
| Family Name: | PIC16F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 56kB |
| RAM Size: | 4kB |
| Speed: | 32MHz |
| No of I/O Lines: | 36 |
| InterfaceType / Connectivity: | I2C/LINbus/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Number Of Timers: | 7 |
| Supply Voltage: | 2.3V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 35-chx10-bit |
| On-Chip DAC: | 1-chx5-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-44 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-44
Mounting Method:
Surface Mount