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Hersteller Artikelnummer
MCP1826S-3002E/DB
1A CMOS LDO, VOUT=3.0V, EXTENDED TEMP RANGE
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| Herstellername: | Microchip | ||||||||||
| Standard Verpackungsart: | Product Variant Information section Verfügbare PaketePaketmenge:78 pro Tube Paketstil:SOT-223 (TO-261-4, SC-73) Montagemethode:Surface Mount | ||||||||||
| Datencode: | |||||||||||
Microchip MCP1826S-3002E/DB - Produktspezifikation
Versandinformationen:
ECCN:
PCN-Informationen:
*** Update for PCN 112912 ***Revision History: March 07, 2025: Issued initial notification.March 10, 2025: Re-issued initial notification to update the Qualification Plan file.May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.November 11, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 10, 2025. Updated affected parts list to add MCP1824ST1202E/DBVAO, MCP1824T1802E/OTVAO, MCP1825S-5002E/DBVAO and MCP1725-5002E/SNVAO catalog part numbers (CPN). Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families of 132k and 133k technologies available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 10 December 2025 (date code: 2550)
******FPCN111387 UPDATE/LOCATION CHANGE******Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.**March 10, 2025: Re-issued initial notification to update the Qualification Plan file.**May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
PCN Status:Final NotificationDescription of Change:Qualification of HANA as an additional assembly site for selected MCP1703x, MCP182xx, TC1108, TC126x and TC2117 device families using 100x87 mils paddle size available in 3L SOT-223 package.Reason for Change:To improve on-time delivery performance by qualifying HANA as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:July 20, 2024 (date code: 2429)
Description of Change:Qualification of HANA as an additional assembly site for selected MCP1703x, MCP182xx, TC1108, TC126x and TC2117 device families using 100x87 mils paddle size available in 3L SOT-223 package.Reason for Change:To improve on-time delivery performance by qualifying HANA as an additional assembly site.
Produktstatus:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=EU&field16=de&field2=MCP1826S-3002E/DB&field4=Microchip&field18=https://p1emea.futureelectronics.com/de/p/semiconductors--analog--regulators-reference--linear-regulators/mcp1826s-3002e-db-microchip-5559927
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=EU&field16=de&field2=MCP1826S-3002E/DB&field4=Microchip&field18=https://p1emea.futureelectronics.com/de/p/semiconductors--analog--regulators-reference--linear-regulators/mcp1826s-3002e-db-microchip-5559927
Microchip MCP1826S-3002E/DB - Technische Eigenschaften
| Input Voltage-Min: | 2.3V |
| Input Voltage-Max: | 6V |
| Output Voltage Fixed: | 3V |
| Dropout Voltage-Max: | 400mV |
| Output Current-Max: | 1A |
| Rated Power: | 2.01W |
| Tolerance (%): | ±2% |
| Operating Temp Range: | -40°C to +125°C |
| Regulator Topology: | Fixed |
| Quiescent Current: | 220µA |
| No. of Outputs: | Single |
| Output Noise: | 2µV |
| Load Regulation (%): | 1% |
| Line Regulation (%): | 0.2% |
| Paketstil: | SOT-223 (TO-261-4, SC-73) |
| Montagemethode: | Surface Mount |
Merkmale und Anwendungen
The MCP1826 series of 1 A, ceramic output cap stable, low output voltage, Low Dropout Regulator (LDO). It is part of the family of LDOs that includes 500 mA MCP1825S and 1.5 A MCP1827S.
The 1000 mA output current capability, combined with the low output voltage capability, make the MCP1826 a good choice for new sub-1.8 V output voltage LDO applications that have high current demands. The MCP1826S is a 3-pin fixed voltage version. The MCP1826S comes in thermally enhanced DDPAK-3 and TO-220-3 packages as well as space-efficient SOT223-3 package.
Features:
- Up to 1 A output load current
- Low dropout voltage 300 mV (typ)
- Output voltage from 0.8 V to 5.0 V
- Stable with 1.0 µF ceramic output cap
- Low supply current 120 µA typical
- DDPAK-3, TO-220-3, SOT223-3 Pb-free packages
Applications:
- High-Speed Driver Chipset Power
- Networking Backplane Cards
- Notebook Computers
- Network Interface Cards
- Palmtop Computers
- 2.5 V to 1.X V Regulators
Verfügbare Pakete
Paketmenge:
78 pro Tube
Paketstil:
SOT-223 (TO-261-4, SC-73)
Montagemethode:
Surface Mount