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Manufacturer Part #
SR087SG-G
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3300 per Reel
SOIC-8EP
Surface Mount
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***UPDATE OF PCN111962/LOCATION CHANGE***Revision History: March 28, 2025: Issued initial notification.January 23, 2026: Issued final notification. Attached the Qualification Report. Revised the affected parts list to remove HV830LG-G catalog part number (CPN). Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Provided estimated first ship date to be on February 16, 2026.Product Category: AC/DC - Inductorless Offline Controllers, Automotive LED Drivers, Backlight LED Drivers, Driver / Interface ICs, EL Backlight Driver ICs, Linear Regulator IcsDescription of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for HV850, HV859, HV833, HV857L, HV823, LR12, SR086, HV857, HV860, AT9933, SR087, HV9912, and HV511 device families of BIC8 100V (66k, 67k, 6QK, 6SK, 6TK) technologies available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 16 February 2026 (date code: 2608)
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for HV850, HV859, HV833, HV857L, HV823, HV830, LR12, SR086, HV857, HV860, AT9933, SR087, HV9912, and HV511 device families of BIC8 100V (66k, 67k, 6QK, 6SK, 6TK) technologies available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: November 2025
PCN Status:Final NotificationDescription of Change:Qualification of MMT as an additional assembly site for HV9925SG-G, SR037SG-G, SR036SG-G, CL320SG-G, CL7SG-G, SR087SG-G, SR086SG-G, HV809SG-G, CL325SG-G and CL330SG-G catalog part numbers (CPN) available in 8L SOIC (3.90mm) package.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:11 December 2024 (date code: 2450)
CCB 1409.16 Final Notice - Additional Fabrication Site: Qualification of an additional fabrication site for HV300, HV310, HV311, PS10, SR086 and SR087 Supertex device families.Description of Change: Qualification of an additional fabrication site for HV300, HV310, HV311, PS10, SR086 and SR087 Supertex device families.Pre Change: Fabricated at SPTX fab site.Post Change: Fabricated at Microchip FAB2 fab siteNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
