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Référence fabricant
93LC86CT-I/ST
93LC86 Series 16 Kbit (2K x 8 / 1K x 16) 5.5V Microwire Compatible Serial EEPROM
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :2500 par Reel Style d'emballage :TSSOP-8 Méthode de montage :Surface Mount |
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Microchip 93LC86CT-I/ST - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 25LC128, 25AA128, 25AA256, 25LC256, 24LC024, 24LC025, 24AA024, 24AA044, 24LC014, 24AA014, 24AA025, AT93C86, 93LC76C, 93AA76C, 93LC86C, 93AA86C, 93C76C, 93C86C, 93LC76A, 93LC76B, 93AA76B, 93AA76A, 93C86A, 93C86B, 93AA86A, 93C76A, 93C76B, 93LC86A, 93LC86B, 93AA86B, 24AA01H, 24LC04B, 24AA02, 24LC02B, 24LC01B, 24FC02, 24FC04, 24AA01, 24FC04H, 24FC01, 24AA04, 24AA02H, 24AA04H, 24FC16, 24LC16B, 24AA08, 24LC08B, 24AA16H, 24AA08H, 24FC08, 24AA16, 25AA080, 25LC080, 25AA160, AT25080, 25LC160, AT25160, AT25320, 25CS320, 25AA320, 25LC320, 25LC640, 25CS640, and 25AA640 device families available in 8L TSSOP (4.4mm) package at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material at MMT assembly site.Change Implementation Status: In ProgressEstimated First Ship Date: 15 April 2026 (date code: 2616)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Statut du produit:
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Microchip 93LC86CT-I/ST - Caractéristiques techniques
| Memory Density: | 16kb |
| Memory Organization: | 2 K x 8 / 1 K x 16 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 3MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Style d'emballage : | TSSOP-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The 93LC86CT-I/ST is a 16 K microwire compatible serial EEPROM; available in TSSOP-8 package.
Features:
- Low-power CMOS technology
- ORG pin to select word size for ‘86C’ version
- Program Enable pin to write-protect the entire array (‘86C’ version only)
- Self-timed erase/write cycles (including auto-erase)
- Automatic ERAL before WRAL
- Power-on/off data protection circuitry
- Industry standard 3-wire serial I/O
- Device Status signal (Ready/Busy)
- Sequential read function
- 1,000,000 E/W cycles
- Data retention > 200 years
- Temperature ranges supported:
- Industrial (I) -40°C to +85°C
- Automotive (E) -40°C to +125°C
Emballages disponibles
Qté d'emballage(s) :
2500 par Reel
Style d'emballage :
TSSOP-8
Méthode de montage :
Surface Mount