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Référence fabricant
MCP632-E/MF
MCP632 Series 5.5 V 24 MHz Rail-to-Rail I/O Operational Amplifier - DFN-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :120 par Std. Mfr. Pkg Style d'emballage :DFN-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP632-E/MF - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 116914 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.November 3, 2025: Re-issued final notification to update affected parts list to add MCP9700T H/TTVAO-VW catalog part number. Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
*** Update for PCN 116870 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CT-I/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
*** Update for PCN 111024 ***Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025Revision History:February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
Description of Change:Qualification of MMT as an additional assembly site for selected MCP1602, MCP1612, MCP1726, MCP1727, MCP622, MCP632, MCP652, MCP662, TC1301x and TC1302x device families available in 8L DFN (3x3x0.9mm) package.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP632-E/MF&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--analog--amplifiers--general-purpose/mcp632-e-mf-microchip-C016303385
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP632-E/MF&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--analog--amplifiers--general-purpose/mcp632-e-mf-microchip-C016303385
Microchip MCP632-E/MF - Caractéristiques techniques
| Amplifier Type: | General Purpose |
| No of Channels: | 2 |
| Slew Rate-Nom: | 10V/µs |
| Input Offset Voltage-Max: | 8mV |
| Gain Bandwidth Product: | 24MHz |
| Average Bias Current-Max: | 4pA |
| Supply Voltage: | 2.5V to 5.5V |
| Common Mode Rejection Ratio: | 81dB |
| Supply Current: | 2.5mA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 76dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 124dB |
| Phase Margin: | 65° |
| Low Noise: | 10nV/√Hz |
| Output Current: | 70mA |
| Style d'emballage : | DFN-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP632 family of operational amplifiers features high gain bandwidth product and high output short circuit current. Some devices also provide a Chip Select pin that supports a low power mode of operation. These amplifiers are optimized for high speed, low noise and distortion, single-supply operation with rail-to-rail output and an input that includes the negative rail.
Features:
- Gain Bandwidth Product: 24 MHz (typical)
- Short Circuit Current: 70 mA (typical)
- Noise: 10 nV/vHz (typical, at 1 MHz)
- Rail-to-Rail Output
- Slew Rate: 10 V/µs (typical)
- Supply Current: 2.5 mA (typical)
- Power Supply: 2.5 V to 5.5 V
- Extended Temperature Range: -40°C to +125°C
Applications:
- Driving A/D Converters
- Power Amplifier Control Loops
- Barcode Scanners
- Optical Detector Amplifier
View the complete product family of MCP63x series Operational Amplifiers
Emballages disponibles
Qté d'emballage(s) :
120 par Std. Mfr. Pkg
Style d'emballage :
DFN-8
Méthode de montage :
Surface Mount
