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Référence fabricant
25AA040AT-I/OT
25AA040A Series 4 Kbit (512 x 8) 5.5 V SMT Bus Serial EEPROM - SOT-23-6
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23-6 (SOT-26) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip 25AA040AT-I/OT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
***UPDATE OF PCN115155***Revision History: August 12, 2025: Issued initial notification.October 16, 2025: Issued final notification. Updated affected part list to removeDescription of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 06 November 2025 (date code: 2545)
***UPDATE OF PCN109250 & PCN111719***Description of Change: Qualification of CuPdAu as a new wire material and 8006NS as a new die attach material for selected 24AA014, 24AA025xxx, 24C01C, 24LC014, 24LC025, 24VL014, 24VL025, 25AA010A, 25AA02xx, 25AA040A, 25LC010A, 25LC020A, 25LC040A, 34AA02, 34LC02, 34VL02, MTCH101 and PIC10F2xx device families available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve productivity by qualifying CuPdAu as a new wire material at MTAI assembly site.Estimated First Ship Date: 11 April 2025 (date code: 2515)
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Description of Change: Qualification of CuPdAu as a new wire material for selected 24AA014, 24AA025, 24C01C, 24LC014, 24LC025, 24VL014, 24VL025, 25AA010A, 25AA02xx, 25AA040A,25LC010A, 25LC020A, 25LC040A, 34AA02, 34LC02, 34VL02, MTCH101 and PIC10F2xx device families available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve productivity by qualifying CuPdAu as a new wire material at MTAI assembly site.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material for selected 24AA0x, 24C01C, 24LC0x, 24VL0x, 25AA0x, 25LC0x, 34AA02, 34LC02, 34VL02, 93AAx, 93C46x, 93C56x, 93C66x, 93C76x, 93C86x, 93LCx, MCP64x, MCP6V1x, MCP6V3x, MCP6V6x, MCP6V7x, MCP6V8x, MCP6V9x, MCP9x, MTCH101, PIC10F20x, PIC10F22x, device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:05 December 2024 (date code: 2449)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 93LCxxx, 93AAxxx, 93Cxxx, PIC10F2xx, 25LC0xxx, 25AA0xxx, MTCH101,24VL0xx, 24LC0xx, 24AA0xxx, 24C01C, 34VL02, 34LC02, 34AA02, MCP40xx, MCP9800xx, MCP9802xx, MCP738xx, MCP950xx, MCP6Vxxx, and MCP64xx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=25AA040AT-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--memory--RAM--eeprom--spi-interface-protocol/25aa040at-i-ot-microchip-9442153
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=25AA040AT-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--memory--RAM--eeprom--spi-interface-protocol/25aa040at-i-ot-microchip-9442153
Microchip 25AA040AT-I/OT - Caractéristiques techniques
| Memory Density: | 4kb |
| Memory Organization: | 512 x 8 |
| Supply Voltage-Nom: | 1.8V to 5.5V |
| Clock Frequency-Max: | 10MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Style d'emballage : | SOT-23-6 (SOT-26) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-6 (SOT-26)
Méthode de montage :
Surface Mount