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Manufacturer Part #
APTGL475A120D3G
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1 per Tube
Module
Chassis Mount
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Product Category: High Voltage Power ModulesDescription of Change: Qualification of INFG as an additional fabrication site for selected APT25GLxx, APT40GLxx, APTGL1xx, APTGL24xx, APTGL32xx, APTGL4xx, APTGL60xx, APTGL70xx, APTGL87xx, APTGL90xx, APTGLQxx, APTLGL3xx, CMADGL1xx, CMANGLQxx, CMAOGLQxx, CMBBGLQxx, CMIEGLQxx, CMLRGLxx, CMMGGLQxx, CMMIGLQxx, CMMISM1xx, CMMVGLQxx, CMRMGL1xx, CMSBGLQxx, CMTFGLQxx, CMZRGLQxx, MSCGLxx, and MSCSM12xx device families available in 1200V IGBT4 Bare Die ProductsReason for Change: To improve on-time delivery performance by qualifying INFG as an additional fabrication site.Estimated First Ship Date: 26 May 2026 (date code: 2622)
Description of Change:Implement new protective packing material changes (Rivet) for selected APTGLxxx, APTGTxxx, APTGX300xx, APTGX400xx, APTGX600xx, APTM1xx, CMATSM120x, CMCFSM170x, CMDGSM170x, CMIVSM170x, CMSAM15Ax, MSCSM120xx, MSCSM170xxx, MSCSM330xxx, MSCSM70xx and MSCSMC120xx device families available in Module package at MP3B assembly site.Reason for Change:To improve productivity by implementing new protective packing material changes (Rivet).
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Implementation of D3-Signal Connector Wedge (MP0360) for selected SIC and IPS products of APTGT300x and MSCSM120AMx device families and CMCFSM170AM058CD3AG, MSCSM70AM025D3AG, MSCSM330DUM07D3AG, CMIVSM170AM058D3AG, MSCSM70AM025CD3AG, MSCSM170AM058CD3AG, MSCSM170AM039CD3AG, CMIVSM170AM039D3AG, CMDGSM170AM039CD3AG, APTMC120AM08CD3AG, CMSAM15AM01D3AG, APTM10AU70D3AG, APTM15AM01D3AG, APTGT400A60D3G, APTGT400A120D3G, APTGL325A120D3G, APTGL475A120D3G, catalog part numbers (CPN).Reason for Change:To improve productivity by implementing D3-Signal Connector Wedge (MP0360).Change Implementation Status:In ProgressEstimated First Ship Date:20 November 2024 (date code: 2447)
Description of Change:Qualification of MP3B as a new assembly site for selected APTGxx, APTMxx, CMCFSxx, CMGEGxx, CMIVSxx, CMSAMxx, CMTHDxx, MSCDxx and MSCSxx device families available in various packages.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying MP3B as a new assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:November 08, 2023 (date code: 2345)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.