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Manufacturer Part #
DSC1001CE1-024.0000
Oscillator, 3225 pkg, -20-70C, 50ppm, 024.0000MHz
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:110 per Tube Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
CCB 3960.001 and 3960.002 Final Notice:Revision History:January 07, 2020: Issued initial notification.January 17, 2020: Reissued initial notification to remove BQM information. The BQM will not be changing.June 01, 2020: Reissued initial notification to update the qualification plan. This is a grade 2 qualification.June 18. 2020: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on July 18, 2020.Description of Change:Qualification of new bill of materials (BOM) for selected Micrel products available in 4L VDFN (3.2 x 2.5 x 0.9 mm) and 4L VDFN (2.5 x 2.0 x 0.9 mm) packages at NSEB assembly site.Pre Change:Assembled at NSEB using NEX-130CT die attach material # 1, 8200T die attach material # 2, G770HCD molding compound and Q3-6646 die coat.Post Change:Assembled at NSEB using HR-5104 die attach material # 1, 2200D die attach material # 2, G700LTD molding compound, and JCR6109 die coat.Reason for Change:To improve manufacturability by qualifying new die attach material, molding compound and die coat.Estimated First Ship Date:July 18, 2020 (date code: 2029)
Revision History:January 07, 2020: Issued initial notification.January 17, 2020: Reissued initial notification to remove BQM information. The BQM will not be changing.June 01, 2020: Reissued initial notification to update the qualification plan. This is a grade 2 qualification.Description of Change:Qualification of new bill of materials (BOM) for selected Micrel products available in 4L VDFN (3.2 x 2.5 x 0.9 mm) and 4L VDFN (2.5 x 2.0 x 0.9 mm) packages at NSEB assembly site.Pre Change:Assembled at NSEB using A194 lead frame material, NEX-130CT die 1 attach material, 8200T die 2 attach material, G770HCD molding compound and Q3-6646 die coat.Post Change:Assembled at NSEB using A194 lead frame material, HR-5104 die 1 attach material, 2200D die 2 attach material, G700LTD molding compound, and JCR6109 die coat.Reason for Change:To improve manufacturability by qualifying new die attach material, molding compound and die coat.Estimated Qualification Completion Date:March 2020
Notification subject: CCB 3433 Final Notice: Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.PCN Status: Final notification.PCN Type: Manufacturing ChangeDescription of Change: Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Pre Change: Die # 2 Fabricated at Silex Microsystems sitePost Change: Die # 2 Fabricated at Microchip Technology Colorado - Fab 5 site.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Colorado - Fab 5 site.Change Implementation Status: In ProgressEstimated First Ship Date: April 17, 2020 (date code: 2016)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Revision History:February 24, 2020: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on April 17, 2020.February 26, 2020: Re-issued final notification. Updated the plant code for die #1 at Taiwan Semiconductor Manufacturing Corp. - Fab 3 from TSMC to TC03 and updated the quality certification for die # 1 at Taiwan Semiconductor Manufacturing Corp. Fab-3.Description of Change:Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Pre Change:Die # 2 Fabricated at Silex Microsystems site.Post Change:Die # 2 Fabricated at Microchip Technology Colorado - Fab 5 site.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Colorado - Fab 5 site.Estimated First Ship Date:April 17, 2020 (date code: 2016)
CCB 3960.001 and 3960.002 Initial Notice: Qualification of new bill of materials (BOM) for selected Micrel products available in 4L VDFN (3.2 x 2.5 x 0.9 mm) and 4L VDFN (2.5 x 2.0 x 0.9 mm) packages at NSEB assembly site.PCN Status: Initial notification.PCN Type: Manufacturing ChangeDescription of Change: Qualification of new bill of materials (BOM) for selected Micrel products available in 4L VDFN (3.2 x 2.5 x 0.9 mm) and 4L VDFN (2.5 x 2.0 x 0.9 mm) packages at NSEB assembly site.Pre Change: Assembled at NSEB using A194 lead frame material, NEX-130CT die 1 attach material, 8200T die 2 attach material, G770HCD molding compound and Q3-6646 die coat.Post Change: Assembled at NSEB using A194 lead frame material, HR-5104 die 1 attach material, 2200D die 2 attach material, G700LTD molding compound, and JCR6109 die coatImpacts to Data Sheet: None.Change Impact: None.Reason for Change: To improve manufacturability by qualifying new die attach material, molding compound and die coat.Change Implementation Status: In ProgressEstimated Qualification Completion Date: March 2020Impacts to Data Sheet: None.Change Impact: None.Reason for Change: To improve manufacturability by qualifying new die attach material, molding compound and die coat.Change Implementation Status: In ProgressEstimated Qualification Completion Date: March 2020
Description of Change:Qualification of new bill of materials (BOM) for selected Micrel products available in 4L VDFN (3.2 x 2.5 x 0.9 mm) and 4L VDFN (2.5 x 2.0 x 0.9 mm) packages at NSEB assembly site.Pre Change: Assembled at NSEB using A194 lead frame material, NEX-130CT die 1 attach material, 8200T die 2 attach material, G770HCD molding compound, Q3-6646 die coat, and a base quantity multiple of 72.Post Change: Assembled at NSEB using A194 lead frame material, HR-5104 die 1 attach material, 2200D die 2 attach material, G700LTD molding compound, JCR6109 die coat, and a base quantity multiple of 110 and 140.
Product Lifecycle:
-
ROHS Compliant -
Lead Free
Technical Attributes
| No of Channels: | 1 |
| Operating Frequency: | 24MHz |
| Supply Voltage-Max: | 3.6V |
| Supply Current: | 6.8mA |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
110 per Tube
Mounting Method:
Surface Mount
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