Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
PIC16LF18345-I/SS
Download the CAD models for this product. Learn more about SnapMagic.
67 per Tube
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Product Category: 16-Bit Microcontrollers, 32-Bit Microcontrollers, 8-Bit Microcontrollers, Capacitive Touch Sensors, USB BridgeDescription of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected PIC32CMx, PIC18F2xx, PIC16F15xx, PIC16LFxx, PIC16F723xx, PIC16F722xx, MTCH6102xx, PIC16F721xx, PIC16F720xx, AR1100Txx, PIC24FVxx, PIC24F32xx, PIC24F16xx,PIC24F08xx, PIC24FV32xx, PIC32CM640xx, PIC16F18xx, AVR64Dxx, PIC16F17xx, AVR32Dxx, AVR16Dxx, PIC18F1xx, ACE15345xx, PIC18LF13Kxx, PIC24F04KAxx, AVR128Dxx, MTCH108xx, AVR32SDxx, HA2022xx, HA2525xx, MCP2200xx, MCP2210xx, HA1127xx, PIC16F19xx, HA1839xx, PIC16F726xx, PIC16F16xx, C0001RIC00xx, PIC16F1459xx, HA1018xx, HA0130xx, PIC18LF23Kxx device families available in 28 and 20L SSOP (.209in) packages at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound at MTAI assembly site.Estimated Qualification Completion Date: August 2026
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected PIC16F18344, PIC16F18444, PIC16F18445, PIC16F18446, PIC16F18345, PIC18F16Q20, PIC18F14Q40, PIC18F15Q40, PIC18F14Q41, PIC18F15Q41, PIC16F18346, PIC16F15345, AVR32DU20, AVR16DU20, PIC16F15344, PIC18F14Q20 and PIC18F15Q20 device families available in 20L SSOP (.209in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying coated copper with gold flash (CuPdAu) as a new bond wire material
Microchip has released a new Datasheet for the PIC16(L)F18325/18345 Full-Featured, Low Pin Count Microcontrollers with XLP Data Sheet of devices. Notification Status: FinalDescription of Change:Updated revision letter; updated package drawings.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 22 Sep 2022
Microchip has released a new Errata for the PIC16(L)F18325/18345 Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change:Updated Data Sheet Revision Letter.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 22 Sep 2022
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
