Embedded software package provides security and connectivity for IoT devices

January 9, 2025

The Flexible Software Package for Renesas RA Family microcontrollers provides a comprehensive set of firmware and middleware components, to give designers a head start in developing MCU-based products.

The Renesas Flexible Software Package (FSP) provides developers working with the Renesas RA Family of microcontrollers with user-friendly, scalable software for embedded system designs. Use of the FSP ensures software compatibility across all devices in the RA Family, from the RA0 series based on a 32 MHz Arm® Cortex®-M23 core to the RA8 series with a 480 MHz Cortex-M85 core.

 

Features of the FSP make it suitable for use in the development of connected IoT devices. These include support for the Arm TrustZone® secure partitioning technology and many other advanced security features, as well as protocol stacks for wireless connectivity via Cat-M1, Wi-Fi®, and Bluetooth® Low Energy technologies.

 

The FSP accelerates the establishment of secure operating frameworks for RA Family microcontrollers thanks to its provision of production-ready drivers, the Azure and FreeRTOS™ real-time operating systems (RTOS), and other middleware stacks. The FSP also includes best-in-class hardware abstraction layer (HAL) drivers which offer high performance and a small memory footprint.

 

Alongside the middleware, Renesas supplies the e² studio integrated development environment, which provides intuitive configurators and intelligent code generation to make programming and debugging easier and faster.

 

The FSP and e² studio can be used free of charge on any Renesas device.

Features

  • Static and dynamic analysis using industry-standard tools
  • TCP/IP and MQTT connectivity protocol stacks
  • USB middleware support for CDC, HID, and MSC modes
  • File system support:
    • FreeRTOS+FAT
    • LittleFS
  • Storage support for SDMMC, SPI, and USB
  • Virtual EEPROM on Flash
  • Capacitive touch middleware
  • Motor control algorithms
  • Secure bootloader through MCUboot
  • Sensor module APIs

Applications

  • IoT devices
  • Industrial automation and sensors
  • Consumer products
  • Home appliances
  • Building automation
  • Medical and healthcare devices
  • Wearable devices
Renesas — FSP Embedded Software Package

Evaluation Board RA0 series

Part Number: RTK7FPA0E1S00001BJ

The FPB-RA0E1 Fast Prototyping Board from Renesas features an RA0E1 microcontroller and a built-in SEGGER J-Link™ emulator circuit, allowing the designer to write and debug programs without the need for additional tools. The board also includes Arduino Uno and Pmod interfaces and through-hole access to all of the MCU pins, making it simple to expand the system.

 

Sample software is available to demonstrate the functionality of the RA0E1 MCU and to facilitate connections between the RA0E1 Fast Prototyping Board and various wireless or sensor modules.

 

The FPB-RA0E1 Fast Prototyping Board is supported by the Renesas Flexible Software Package (FSP) for embedded system designs.

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