Future Electronics — New System-on-Module (SOM) Boards for NXP i.MX 8M Plus Processor

Future Electronics System on Module Boards for NXP i.MX 8M Plus Applications

Ready-made computing platforms for i.MX 8M Plus processor

Future Electronics supplies two System-On-Module (SOM) products which provide a complete board-level computing environment for the NXP Semiconductors i.MX 8M Plus applications processor.


The NXP processor offers the high computing performance and wide range of peripheral features required in the latest machine learning and machine vision applications, as well as supporting advanced multimedia and industrial automation products. The i.MX 8M Plus features two or four Arm® Cortex®-A53 processor cores. Machine learning operations benefit from an on-chip Neural Processing Unit (NPU) operating at up to 2.3TOPS.


To support machine vision systems, the processor also features two camera inputs and dual Image Signal Processors (ISPs) capable of generating a High Dynamic Range (HDR) output at a resolution of up to 1080p, backed by 3D and 2D graphics acceleration.


An 800MHz Arm Cortex-M7 microcontroller core allows developers to implement real-time control functions.


Providing a rich set of communications interfaces, the iW-RainboW-G40M SOM from iWave can be supplied with the i.MX 8M Plus processor in its dual-core, quad-core lite or quad-core versions. Communications capabilities include wireless 802.11a/b/g/n/ac Wi-Fi® and Bluetooth® 5.0 radios, and a dual 1000/100/10Mbits/s Ethernet port, with support for Time-Sensitive Networking (TSN) on one port.


The iWave SOM is also offered with the option of a GNSS positioning receiver module.


A quad-core i.MX 8M Plus processor supplies the high-performance computing power for the Karo Electronics QSXP-ML81 SOM. It is supported by 2Gbytes of LPDDR4 DRAM and an 8Gbyte eMMC chip for data storage.


This compact module in a surface-mount 29mm x 29mm QFN package includes a wide variety of connectivity options, including:

  • Gigabit Ethernet
  • PCIe
  • S/PDIF
  • I2S/Serial audio interface
  • USB 2.0 and USB 3.0
  • Multiple UART, I2C, PWM and serial peripheral interfaces
  • Two CAN interfaces
  • Two MIPI camera interfaces
  • LVDS/MIPI DSI display interface

The Karo module’s package provides for easy integration into embedded computing systems, and simplifies the assembly and production process. All signal connections are located at the edge of the module, allowing for easy optical inspection during production. The module can be assembled by automatic pick-and-place machines without any mechanical assembly work necessary.


The module may be mounted on a simple, two-layer base board. Karo also supplies the TX8P-ML81 module based on the i.MX 8M Plus, a SODIMM card measuring 68mm x 26mm x 4mm.

Features: i.MX 8M Plus

  • Inline DRAM error correction code
  • 1080p60 and h.265/4 video codecs
  • Low-power voice accelerator
  • 375Mpixels/s camera input rate


  • Smart homes and buildings
  • Smart city applications
  • Industry 4.0 equipment
  • Consumer electronics
  • Industrial HMI

Development Kit

Kit Part Number: QSXP-SV01

The Karo Electronics QSXP QSBASE3 evaluation kit is supplied with a Linux® operating system pre-installed, and is ready for application development.

Kit Part Number: iW-RainboW-G40D

The iWave iW-RainboW-G40D includes the iW-RainboW-G40M SOM and carrier board with all necessary interface connectors for developing an embedded application based on NXP’s i.MX 8M Plus processor.

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