FTM / Intelligent Sensing / Infineon — AIROC CYW20835 Bluetooth LE SoC Modules
Infineon supplies AIROC™ CYW20835 modules which provide a complete system solution for Bluetooth® Low Energy connectivity.
The fully integrated CYBLE-343072-02, CYBLE-333073-02, and CYBLE-333074-02 modules include a crystal oscillator, passive components, and Flash memory alongside the AIROC CYW20835, a Bluetooth Low Energy radio system-on-chip (SoC). The modules, housed in a 13.31 mm x 21.89 mm x 1.95 mm package, include a royalty-free Bluetooth stack compatible with the Bluetooth 5.0 specifications. These application-ready modules help OEMs to save development time and accelerate time-to-market.
The modules are supported by the AIROC Bluetooth software development kit in the ModusToolbox™ software suite, which includes code examples of embedded Bluetooth Low Energy applications. Infineon certifies these modules for compliance with RF regulations worldwide, saving developers cost and time in product development.
The AIROC modules are based on the CYW20835 Bluetooth Low Energy SoC, which complies with the Bluetooth 5.2 core specification. The SoC has an integrated microcontroller based on a 96 MHz Arm® Cortex®-M4 processor core, which can run the Bluetooth protocol stack and the application.
The SoC’s Bluetooth radio is energy-efficient, drawing just 8 mA in receive mode and 18 mA when transmitting at the maximum 12 dBm output power.
Part Number: CYW920835M2EVB-01
The CYW20835 device and the CYW920835M2EVB-01 evaluation kit are supported in ModusToolbox 2.3 and the Bluetooth SDK 3.0 or later. The kit’s hardware includes:
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