Boyd, the largest provider of thermal management solutions and engineering services in the world, has introduced a surface-mount heat-sink which is suitable for use with power semiconductors in a D2PAK (TO-263) package.
The matte tin-plated 573300D00010G heat-sink removes the heat indirectly without contacting the device as traditional through-hole heat sinks do. The device and the heat-sink are soldered directly to a modified drain pad, creating a thermal transfer path from the package tab to the heat-sink.
