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Manufacturer Part #
MCP6141T-E/OT
MCP6141 Series 6 V 100 kHz Rail-to-Rail I/O Operational Amplifier SOT-23-5
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-5 (SOT-25) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2514 | ||||||||||
Microchip MCP6141T-E/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
***UPDATE OF PCN113920***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 19 August 2025 (date code: 2534)
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx,TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6141T-E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--amplifiers--general-purpose/mcp6141t-e-ot-microchip-2037154
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6141T-E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--amplifiers--general-purpose/mcp6141t-e-ot-microchip-2037154
Microchip MCP6141T-E/OT - Technical Attributes
| Amplifier Type: | General Purpose |
| No of Channels: | 1 |
| Slew Rate-Nom: | 0.024V/µs |
| Input Offset Voltage-Max: | 3mV |
| Gain Bandwidth Product: | 100kHz |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 1.4V to 6V |
| Common Mode Rejection Ratio: | 80dB |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 85dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 115dB |
| Phase Margin: | 60° |
| Low Noise: | 170nV/√Hz |
| Output Current: | 20mA |
| Package Style: | SOT-23-5 (SOT-25) |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP6141T-E/OT is a part of MCP6141 Series Amplifiers .It can sustain a operating temperature ranging from -40°C to 125°C, it is available in SOT-23-5 package.
The MCP6141 is a single 600 nA op amp offering rail-to-rail input & output over the 1.4 to 5.5 V operating range. This amplifier has a typical GBWP of 100 kHz with a maximum quiescent current of 1 microampere.
Features:
- Low Quiescent Current: 600 nA/amplifier (typical)
- Gain Bandwidth Product: 100 kHz (typical)
- Stable for gains of 10 V/V or higher
- Rail-to-Rail Input/Output
- Wide Supply Voltage Range: 1.4 V to 6.0 V
- Available in Single, Dual, and Quad
- Chip Select (CS) with MCP6143
- Available in 5-lead and 6-lead SOT-23 Packages
- Temperature Ranges:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
Applications:
- Toll Booth Tags
- Wearable Products
- Temperature Measurement
- Battery Powered
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-5 (SOT-25)
Mounting Method:
Surface Mount