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Manufacturer Part #
MIC2981/82YWM-TR
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1000 per Reel
SOIC-18
Surface Mount
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Description of Change: Qualification of MTAI as an additional assembly site for MIC2981/82YWM, MIC2981/82YWM-TR, MIC5841YWM, MIC5841YWM-TR, MIC5842YWM, MIC5842YWM-TR, MIC58P42YWM and MIC58P42YWM-TR catalog part numbers (CPN) available in 18L SOIC (.300in) package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Estimated Qualification Completion Date: January 2026
UPDATE TO PCN 110887.Revision History: February 14, 2025: Issued initial notification.September 10, 2025: Issued final notification. Updated scope to remove MIC5200, MIC5201, MIC5202 device families and MIC5841YV-TR catalog part number and add 835-5043, LP2951, MIC2172, MIC2915x, MIC2920x, MIC2930xx, MIC2931x, MIC29371, MIC2941A, MIC29502, MIC2951, MIC2951x, MIC2954, MIC297xx, MIC2981, MIC3172, MIC37252, MIC37303, MIC3750x, MIC38C43, MIC38HC4x, MIC3915x, MIC3930x, MIC3950x, MIC3975, MIC457x, MIC501x, MIC502x, MIC5060, MIC515x, MIC580x and MIC58Pxx device families. Attached Qualification Report. Provided estimated first ship date to be on October 31, 2025.
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
**FPCN97963 UPDATE**Revision History:May 10, 2023: Issued initial notification.June 21, 2024: Issued final notification. Attached the Qualification Report. Revised the Notification Subject to specify all affected device families. Provided estimated first ship date to be on July 19, 2024.Description of Change:Qualification of UNIG as an additional final test site for LM2574, LM2575, MIC2145, MIC2202, MIC2203, MIC2204, MIC2981, MIC4574, MIC4826, MIC4827, MIC4830, MIC4832, MIC4833, MIC5800, MIC5801, MIC5891, MIC58P01 and MIC59P50 device families available in Tube and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as an additional final test site.
Description of Change:Qualification of UNIG as an additional final test site for MIC2xxx, MIC4xxx, MIC5xxx and LM257xxx device families available in Tube and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as an additional final test site.
Part Status:
The MIC2981/82YWM TR is an 8-channel, high-voltage, high-current source driver array ideal for switching high-power loads from logic-level TTL, CMOS, or PMOS control signals. These drivers can manage multiple loads of up to 50 V and 500 mA, limited only by package power dissipation.
Micrel’s MIC2981/82 features inputs compatible with 5 V TTL and 5 V to 15 V CMOS or PMOS logic outputs. Micrel’s dual-marked device replaces either UDN2981 or UDN2982 devices. The MIC2981/82 is available in the 18-pin plastic DIP and 18-lead wide SOP package. Both devices operate in the industrial temperature range.
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
