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AT24C128C-SSHM-T
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4000 per Reel
SOIC-8
Surface Mount
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Product Category: 8-Bit Microcontrollers, MemoryNotification Subject: CCB 8431.001 Initial Notice: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 25LC08xx, 25CS08xx, 25AA08xx, AT2508xx, 25AA16xx, 25LC16xx, 25CS16xx, AT2516xx, 93C76Axx,93C86Axx, 93LC76xx, 93LC86xx, 93AA76xx, 93AA86xx, 93C76Bxx, 93C86Bxx, 93C76Cxx, 93C86Cxx, AT93C8xx, 24LC02xx, 24LC01xx, 24AA01xx, 24AA02xx, AT24C0xx, 24AA04xx, ATtinyxx, AT25M0xx, AT24C5xx,AT24CMxx,25LC25xx,25AA25xxNote: See attached SPCN document for more detailed description Description of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 25LC08xx, 25CS08xx, 25AA08xx, AT2508xx, 25AA16xx, 25LC16xx, 25CS16xx, AT2516xx, 93C76Axx, 93C86Axx, 93LC76xx, 93LC86xx, 93AA76xx, 93AA86xx, 93C76Bxx, 93C86Bxx, Note: See attached SPCN document for more detailed description Reason for Change: To improve manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound at MTAI assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: October 2026
Product Category: MemoryNotification Subject: CCB 8400 Initial Notice: Qualification of MMT as an additional assembly site for selected 24AA102x, 24AA128, 24AA256, 24AA32A, 24AA32AF, 24AA512, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC102x, 24FC128, 24FC256, 24FC512, 24FC64, 24FC64F, 24LC102x, 24LC128, 24LC256, 24LC32A, 24LC32AF, 24LC512, 24LC64, 24LC64F, 25CSM01, AT24C128C, AT24C256C, AT24C32x, AT24C512C, AT24C64x, AT24CM01 and AT25M01 device families available in 8L SOIC (3.90mm) packageDescription of Change: Qualification of MMT as an additional assembly site for selected 24AA102x, 24AA128, 24AA256, 24AA32A, 24AA32AF, 24AA512, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC102x, 24FC128, 24FC256, 24FC512, 24FC64, 24FC64F, 24LC102x, 24LC128, 24LC256, 24LC32A, 24LC32AF, 24LC512, 24LC64, 24LC64F, 25CSM01, AT24C128C, AT24C256C, AT24C32x, AT24C512C, AT24C64x, AT24CM01 and AT25M01 device families available in 8L SOIC (3.90mm) package.Pre and Post Summary Changes:Pre ChangeMicrochip Technology Thailand (HQ)(MTAI)Post ChangeMicrochip Technology Thailand (HQ)(MTAI)Note: See attached SPCN document for more detailed descriptionReason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: September 2026
Description of Change: Qualification of MMT as an additional assembly site for selected AT24C32E, AT24C64D, 24CS32, 24CS64, AT24C32D, 24AA64, 24FC64, 24AA32AF, 24LC64, 24LC32AF, 24LC32A, AT24C64B, 24AA32A, 24AA64F, 24LC64F, 24FC64F, AT24C128C, 24LC128, 24FC128, 24AA128, 24CS128, 24AA256, AT24C256C, 24LC256, 24CS256, 24FC256, AT24CM01, 24FC1025, 24LC1025, 24LC1026, 24AA1025, 24FC1026, 24AA1026, 24CSM01, 24CW640, 24CW320, 24CW160 and 24CW1280 device families, qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected AT24C512C, 24AA512, 24LC512, 24FC512 and 24CS512 device families at MMT assembly site available in 8L SOIC (3.90mm) package.Reason for Change: To improve on-time delivery performance and manufacturability by qualifying MMT as an additional assembly site, palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.Estimated First Ship Date: 26 May 2026 (date code: 2622)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change:Qualification of U08D as a new fabrication location for selected AT24C128C, 24LC128, 24FC128, and 24AA128 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date:27 March 2025 (date code: 2513)Revision History:January 18, 2025: Issued initial notification.February 19, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be March 27, 2025.
Description of Change: Qualification of QMI-519 die attach material at MTAI assembly site for AT24C128C-SSHM-B, 24LC128-I/SN, 24AA128-I/SN, 24FC128-I/SN, AT24C128C-SSHM-T, 24LC128T-I/SN, 24AA128T-I/SN, 24FC128T-I/SN, 24LC128T-E/SN, 24FC128T-E/SN, 24LC128-E/SN, and 24FC128-E/SN catalog part numbers (CPN) available in 8L SOIC (3.90mm) package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying QMI-519 die attach material at MTAI assembly site.Estimated First Ship Date: 30 March 2025 (date code: 2513)
Description of Change:Qualification of U08D as a new fabrication location for selected AT24C128C, 24LC128, 24FC128, and 24AA128 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
