Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
AT25160B-XHL-B
Download the CAD models for this product. Learn more about SnapMagic.
100 per Tube
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Product Category: Crypto Authentication, Crypto Memory, MemoryDescription of Change: Implement new packing materials and packing changes for AT34C02D, AT24C08D, AT24HC02C, AT88SC0104CA, AT88SC1616C, AT88SC0404CA, AT24MAC602, ATSHA204A, ATECC608A, ATECC508A, AT93C66B, ATECC108A, ATECC608C, AT24C16C, AT88SC0808CA, AT25160B, AT25080B, 25CS160, 24LC64, AT24C01C, AT24C04C, AT24C128C, AT24C04D, 24AA16H, AT24C08C, 24AA02H, 24LC04B, 24LC16B, AT93C56B, 24AA04H, 24AA01H, 24LC04BH, 24LC02BH, 24LC01BH, 25AA640A, 25LC640A, AT93C46E, 25CS640, AT24CM01, AT24C256C, 24AA256, AT24C512C, 24AA512, 24LC512, AT24C02C, AT25320B, 24LC256, 24FC256, 24FC512, AT24CM02, AT24C64B, AT24HC04B, AT24MAC402, AT24C16D, 25CSM04, AT93C86A, AT93C46D, AT24C02D and AT24C64D device families available in 8L SOIC and TSSOP (3.90mm and 4.4mm) packages.Reason for Change: To improve manufacturability by implementing new packing materials and packing changes.Estimated First Ship Date: 17 July 2026 (date code: 2629)
Description of Change:Qualification of ASSH and MTAI as an additional final test sites for AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-B, AT25160B-XHL-T catalog part numbers (CPN) and qualification of ASSH as an additional final test site for selected 25LC080D, 25LC160C, 25LC160D, 25AA080C, 25AA080D, 25AA160C, 25AA160D, and 25LC080C devices families in 8L TSSOP (4.4mm) package, together with qualification of MTAI as an additional final test site for AT25080B-SSHL-T, AT25080B-SSHL-B, AT25160B-SSHL-B, and AT25160B-SSHL-T catalog part numbers (CPN) available in 8L SOIC (3.90mm) package.Reason for Change:To improve on-time delivery performance by qualifying ASSH and MTAI as an additional final test sites.
Product Category: MemoryDescription of Change: Qualification of ASSH as an additional assembly site and qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material, AMK-EP27 as a new die attach material and AMK-MC27 as a new mold compound material at ANAP assembly site for AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part numbers (CPN) available in 8L TSSOP (4.4mm) packageReason for Change: To improve manufacturability and on-time delivery performance by qualifying of ASSH as an additional assembly site and qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material, AMK-EP27 as a new die attach material and AMK-MC27 as a new mold compound material at ANAP assembly site.Estimated First Ship Date: 30 April 2026 (date code: 2618)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 25LC128, 25AA128, 25AA256, 25LC256, 24LC024, 24LC025, 24AA024, 24AA044, 24LC014, 24AA014, 24AA025, AT93C86, 93LC76C, 93AA76C, 93LC86C, 93AA86C, 93C76C, 93C86C, 93LC76A, 93LC76B, 93AA76B, 93AA76A, 93C86A, 93C86B, 93AA86A, 93C76A, 93C76B, 93LC86A, 93LC86B, 93AA86B, 24AA01H, 24LC04B, 24AA02, 24LC02B, 24LC01B, 24FC02, 24FC04, 24AA01, 24FC04H, 24FC01, 24AA04, 24AA02H, 24AA04H, 24FC16, 24LC16B, 24AA08, 24LC08B, 24AA16H, 24AA08H, 24FC08, 24AA16, 25AA080, 25LC080, 25AA160, AT25080, 25LC160, AT25160, AT25320, 25CS320, 25AA320, 25LC320, 25LC640, 25CS640, and 25AA640 device families available in 8L TSSOP (4.4mm) package at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material at MMT assembly site.Change Implementation Status: In ProgressEstimated First Ship Date: 15 April 2026 (date code: 2616)
***UPDATE OF PCN109251 & PCN109508***Revision History: November 26, 2024: Issued initial notification.December 03, 2024: Re-issued initial notification. Corrected the year to April 2025 in the Timetable SummaryDecember 23, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on March 01, 2026. Added column "Change (Yes/No)" in the pre and post change table.Description of Change: Qualification of 36.5K process technology for selected products of the 25AA080C, 25AA080D, 25AA160C, 25AA160D, 25LC080C, 25LC080D, 25LC160C, 25LC160D, AT25080B and AT25160B device families.Reason for Change: To improve manufacturability by qualifying additional process technology.Estimated First Ship Date: 01 March 2026 (date code: 2609)
Description of Change: Qualification of 36.5K process technology for selected products of the 25AA080C, 25AA080D, 25AA160C, 25AA160D, 25LC080C, 25LC080D, 25LC160C, 25LC160D, AT25080Band AT25160B device families.Reason for Change: To improve manufacturability by qualifying additional process technology.
Description of Change: Qualification of 36.5K process technology for selected products of the 25AA080C, 25AA080D, 25AA160C, 25AA160D, 25LC080C, 25LC080D, 25LC160C, 25LC160D, AT25080B and AT25160B device families.Reason for Change: To improve manufacturability by qualifying additional process technology.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
