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Manufacturer Part #
PIC18F26J13-I/SS
PIC18F Series 64 KB Flash 3.8 KB RAM 48 MHz 8-Bit Microcontroller - SSOP-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:47 per Tube Package Style:SSOP-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
CCB 3254 and CCB 3254.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 20L and 28L SSOP package at MTAI assembly site Pre Change: Using palladium coated copper wire (PdCu) bond wire Post Change: Using palladium coated copper with gold flash (CuPdAu) bond wire.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 20L and 28L SSOP package at MTAI assembly site.Pre Change: Using palladium coated copper wire (PdCu) bond wire.Post Change: Using palladium coated copper with gold flash (CuPdAu) bond wireReason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Estimated Qualification Completion Date:April 2018
Description of Change:Qualification of MMT as an additional assembly site using gold (Au) bond wire for selected products available in 28L SSOP package.Pre Change: Assembled at MTAI or ANAP assembly sites.Post Change:Assembled at MTAI or ANAP or MMT assembly sitesReason for Change:To improve productivity by qualifying MMT as an additional assembly site. Estimated First Ship Date:December 17, 2017 (date code: 1751)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Final Notification:Revision History:July 6, 2017: Issued initial notification.October 23, 2017: Issued final notification. Provided estimated first ship date to be on November 24, 2017.Description of Change:Qualification of MMT as an additional assembly site using palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.25um TSMC wafer technology available in 28L SSOP package.Pre Change: Assembled at MTAI using palladium coated copper (PdCu) bond wire.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site using palladium coated copper with gold flash (CuPdAu) bond wire.Estimated First Ship Date:November 24, 2017 (date code: 1747)Post Change:Assembled at MTAI using palladium coated copper (PdCu) bond wire or assembled at MMT using palladium coated copper with gold flash (CuPdAu) bond wire.
Product Lifecycle:
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ROHS Compliant -
Lead Free
Technical Attributes
| Family Name: | PIC18F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 64kB |
| RAM Size: | 3.8kB |
| Speed: | 48MHz |
| No of I/O Lines: | 22 |
| InterfaceType / Connectivity: | I2C/LIN/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 2.15V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 10-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | SSOP-28 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
47 per Tube
Package Style:
SSOP-28
Mounting Method:
Surface Mount
