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Manufacturer Part #
MCP23018-E/MJ
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91 per Tube
QFN-24
Surface Mount
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PCN Information:
Product Category: 8-Bit Microcontrollers, Capacitive Touch Sensors, Computing I/O Controllers, Interface- Serial Peripherals, PoE PD, PoE PSE, Touchscreen Controllers, USB Bridge, Wireless Power And USB-PD ControllerNotification Subject: CCB 8435 Initial Notice: Qualification of 558-2C31 as a new die attach material for selected SEC1110, ATMEGA324PHBL, ATMEGA324P, MCP23S18, MCP23018, PIC16F1938, ECE1200, WP200RX01, PIC16F616, WP300RX01, MCP23009, PIC16F1518, MTCH6102, MCP23S09, AT90CAN64, AT90CAN128, AT90CAN32,PD70224, PD69108, PD69104B1, ATMEGA328P, ATMXT144UD-A, ATMXT288UD-A, ATMXT144UD-SL, ATMEGA168, ATTINY861, AT90USB647, AT90USB646, PD69104 and ATMEGA164P device families available in various packages at NSEB and UTL3 assembly sites.Description of Change: Qualification of 558-2C31 as a new die attach material for selected SEC1110, ATMEGA324PHBL, ATMEGA324P, MCP23S18, MCP23018, PIC16F1938, ECE1200, WP200RX01, PIC16F616, WP300RX01, MCP23009, PIC16F1518, MTCH6102, MCP23S09, AT90CAN64, AT90CAN128, AT90CAN32,PD70224, PD69108, PD69104B1, ATMEGA328P, ATMXT144UD-A, ATMXT288UD-A, ATMXT144UD-SL, ATMEGA168, ATTINY861, AT90USB647, AT90USB646, PD69104 and ATMEGA164P device families available in various packages at NSEB and UTL3 assembly sites.Pre and Post Summary Changes: See attached SPCN documentReason for Change: To improve manufacturability by qualifying 558-2C31 as a new die attach material at NSEB and UTL3 assembly sites.Estimated Qualification Completion Date: December 2026
***UPDATE OF PCN111157***Description of Change: Qualification of MTAI as an additional assembly site for MCP23S18-E/MJ, MCP23018-E/MJ, MCP23018T-E/MJ and MCP23S18T-E/MJ catalog part numbers (CPN) available in 24L QFN (4x4x0.9mm) package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as additional assembly site.Revision History: February 28, 2025: Issued initial notificationJune 17, 2025: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on July 04, 2025.
Description of Change: Qualification of MTAI as an additional assembly site for MCP23S18-E/MJ, MCP23018-E/MJ, MCP23018T-E/MJ and MCP23S18T-E/MJ available in 24L QFN (4x4x0.9mm) package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as additional assembly site.
Part Status:
On Order
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