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Référence fabricant
BM70BLES1FC2-0B04AA
Bluetooth BLE Module, Shielded, Antenna, 12x22mm Industrial Temp
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :88 par Tray Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip BM70BLES1FC2-0B04AA - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
***FPCN109722 UPDATE***Revision History:December 17, 2024: Issued initial notification.January 24, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on February 24, 2025.Description of Change:Qualification of MTAI as an additional final test site for selected BM70, BM71, RN4870, RN4871 device families available in 16L (11.5x9x2.1 mm), 33L (12x22mm), 30L (12x15mm) and 17L (8x6x1.6 mm) Module packages.
Description of Change:Qualification of MTAI as an additional final test site for selected BM70, BM71,RN4870, RN4871 device families available in 16L (11.5x9x2.1 mm), 33L (12x22mm), 30L (12x15mm)and 17L (8x6x1.6 mm) Module packages.Reason for Change: To improve on-time delivery performance by qualifying MTAI as an additional finaltest site.V
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=BM70BLES1FC2-0B04AA&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--wireless-rf--rf-modules-solutions--proprietary/bm70bles1fc2-0b04aa-microchip-7106094
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=BM70BLES1FC2-0B04AA&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--wireless-rf--rf-modules-solutions--proprietary/bm70bles1fc2-0b04aa-microchip-7106094
Microchip BM70BLES1FC2-0B04AA - Caractéristiques techniques
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
88 par Tray
Méthode de montage :
Surface Mount