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STMicroelectronics

Spatial awareness for the next generation of intelligent devices

As products become increasingly autonomous and responsive, many applications require more than simple proximity detection. Robotics, smart buildings, gesture-controlled interfaces, and industrial equipment benefit from understanding where people and objects are located within a three-dimensional space.

The STMicroelectronics VL53L9CX brings this capability to compact designs as a direct Time-of-Flight (dToF) 3D LiDAR module, delivering high-resolution depth information for real-time spatial awareness. With up to 2.3K zones, 8.8 m ranging, and 100 Hz operation, it enables systems to detect and locate objects across a scene.

Built for real-world designs

The VL53L9CX integrates dual 940 nm VCSELs, SPAD receivers, meta surface optics, infrared filters, VCSEL drivers, PMIC, and embedded processing into a single reflowable module. This reduces external optical components while providing 3D depth, 2D infrared, ambient, reflectance, and confidence data.

Its 12.8 × 6.1 × 4.6 mm package, wide 55° × 42° field of view, and cover-glass compensation make it well suited to space-constrained products and challenging real-world environments. Support for I3C and MIPI CSI enables integration with STM32 microcontrollers and application processors.

Features

  • 2.3K-zone 3D dToF LiDAR
  • <5 cm to 8.8 m ranging
  • Up to 100 Hz
  • 55° × 42° field of view
  • Dual 940 nm VCSEL flood illumination
  • 2D IR + 3D depth output
  • Reflectance and confidence maps
  • Class 1 laser
  • 12.8 × 6.1 × 4.6 mm
  • I3C and MIPI CSI interfaces
  • Single reflowable module

Applications

  • Mobile robots
  • Drones
  • People-counting systems
  • Smart building occupancy sensors
  • Smart lighting controllers
  • AR/VR headsets
  • Industrial tank and bin monitors
  • Video projectors

From sensing to smarter products

The VL53L9CX gives designers access to detailed spatial information that can be used to make products more aware of their surroundings.

In robotics and autonomous systems, 3D depth information can support obstacle avoidance, navigation, SLAM, and small-object detection. In smart buildings and lighting systems, it can enable people detection and occupancy awareness. In AR/VR devices, multizone depth sensing can support room mapping, gesture recognition, and skeletal tracking. Industrial applications can use spatial sensing for liquid-level measurement, tank and bin monitoring, people mapping, and load detection.

The technology can also complement cameras and other sensors when a design needs more than visual information alone. By adding accurate depth and distance data, the VL53L9CX can help systems understand where an object is, how far away it is, and how its position changes over time.

Supporting the complete design

Getting from evaluation to implementation is supported by the wider ST ecosystem. The VL53L9CX can be evaluated using the X-NUCLEO-53L9A1 evaluation board together with the NUCLEO-H563ZI development board and the STSW-IMG052 Eval GUI. The evaluation setup requires both boards to be connected, with the software and complete configuration steps detailed in the ST user manual.

From initial evaluation through product development, ST provides the software, documentation and design resources to help accelerate implementation, including CAD symbols, PCB footprints and 3D models.

With support for I3C and MIPI CSI interfaces and 1.2 V / 3.3 V power supplies, the VL53L9CX is designed for integration with platforms such as STM32 microcontrollers and application processors. Additional image, motion, and environmental sensors can be combined with the VL53L9CX when applications require a broader understanding of their surroundings.

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STM VL53L