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Référence fabricant
BSP170PH6327XTSA1
Single P-Channel 60 V 300 mOhm 10 nC SIPMOS® Small Signal Mosfet - SOT-223
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1000 par Reel Style d'emballage :SOT-223 (TO-261-4, SC-73) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2525 | ||||||||||
Infineon BSP170PH6327XTSA1 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Detailed change informationSubject Transfer of wafer production, wafer test and pre-assembly location to IFX Kulim, and change of wafer diameter from 150 mm to 200 mm, and implementation of new mould compound for PG-TO252 package, for P-Channel Small Signal and Power MOSFETsReason Wafer production, wafer test and pre-assembly location will be transferred according to the global Infineon production strategyDescription Wafer production and wafer test locationWafer diameterPre-assembly location Wafer LotnumberMould compound(PG-TO252)Halogen Free Flag (PG-TO252)OPN incl. SP#(PG-TO252)Production Lot code Marking on device (PG-TO252) Note: See SPCN document for detailed description of changesIntended start of delivery 2026-03-31 or earlier based on customer approval
Detailed change informationSubject: Introduction of additional plating production at Wuxi Welnew Microelectronic Co., Ltd., Wuxi, China for several productsReason/Motivation:Expansion of plating production to assure continuity of supply and enable flexible manufacturing by recovery of Welnew Wuxi Plating site for DS products (PCN 2023-034-A) DescriptionOldShanghai Welnew Microelectronic Co., Ltd., Shanghai, ChinaNewShanghai Welnew Microelectronic Co., Ltd., Shanghai, ChinaWuxi Welnew Microelectronic Co., Ltd., Wuxi, ChinaIntended start of delivery: 2026-06-20Last order date (LOD): 2026-06-20Last delivery date (LDD): 2026-12-20
Detailed change information Subject Change of plating production site from Wuxi Welnew Micro. Co., Ltd., Wuxi, China to Infineon Technologies (Malaysia) Sdn. Bhd., Melaka, Malaysia and Shanghai Welnew Micro. Co., Ltd., Shanghai, China due to Wuxi Welnew site burning down Reason To assure continuity of supply, plating production site will be transferred to Infineon Technologies (Malaysia) Sdn. Bhd., Melaka, Malaysia and Shanghai Welnew Microelectronic Co., Ltd., Shanghai, China
**Expanded part list**Subject Change of plating production site from Wuxi Welnew Micro. Co., Ltd., Wuxi, China to Infineon Technologies (Malaysia) Sdn. Bhd., Melaka, Malaysia and Shanghai Welnew Micro. Co., Ltd., Shanghai, China due to Wuxi Welnew site burning down Reason To assure continuity of supply, plating production site will be transferred to Infineon Technologies (Malaysia) Sdn. Bhd., Melaka, Malaysia and Shanghai Welnew Microelectronic Co., Ltd., Shanghai, China
Subject Change of plating production site from Wuxi Welnew Micro. Co., Ltd., Wuxi, China to Infineon Technologies (Malaysia) Sdn. Bhd., Melaka, Malaysia and Shanghai Welnew Micro. Co., Ltd., Shanghai, China due to Wuxi Welnew site burning down Reason To assure continuity of supply, plating production site will be transferred to Infineon Technologies (Malaysia) Sdn. Bhd., Melaka, Malaysia and Shanghai Welnew Microelectronic Co., Ltd., Shanghai, China Final qualification report 2023-06-15 (for Shanghai Welnew) First samples available on request Instart of delivery 2023-02-06
Business Continuity Customer Notification Fire incident at manufacturing partner in Wuxi (China).Status of 19 January 2023 (Update #1) Dear valued customer, On 6 January 2023, a fire incident took place at the production site of one of our manufacturing partners in Wuxi (China). Its plating lines that support our Infineon site in Wuxi were severely damaged by the fire. The circumstances are beyond our reasonable control. We are in close exchange with the affected manufacturing partner. Our supplier will however not be able to provide services to Infineon until further notice. Our dedicated team immediately activated short- and mid-term mitigation plans. We quickly pursued options to shift the production of affected technologies at our manufacturing site in Wuxi to other sites within our global production network and are now implementing respective capacity shifts to minimize impact on our supply capability. Delivery plans are currently being updated and affected customers have been informed individually through the established channels. We are working diligently on resolving the critical supply situation and expect to resume delivery by mid February 2023. We apologize for any inconvenience as a result of this incident.
With this Infineon Technologies AG information note, we would like to inform you about the following:Detailed change information: Subject:Early Problem Notification: Burning down of plating production site Wuxi Welnew Microelectronic Co., Ltd., Wuxi, China affecting Infineon's products in packages P-/PG-SC74*, -SOD323*, - SOT143*, -SOT23*, and PG-SC79*, -SOT223*, -SOT323*, - SOT343*, -SOT363*, -SOT89*, -TDSON*, -TSFP*, -TSSOP* *: accompanied by different numbers of leads and version, for detailed info, please use affected product list as attached. Reason: On 6 January 2023, a fire incident took place at the production site of one of our manufacturing partners "Wuxi Welnew Microelectronic Co., Ltd., Wuxi, China". Its plating lines which support our Infineon site in Wuxi (Infineon Technologies (Wuxi) Co., Ltd., Wuxi, China) were severely damaged by the fire. Our manufacturing partner will not be able to provide services to Infineon until further notice.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=BSP170PH6327XTSA1&field4=Infineon&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--mosfets/bsp170ph6327xtsa1-infineon-9178186
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=BSP170PH6327XTSA1&field4=Infineon&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--mosfets/bsp170ph6327xtsa1-infineon-9178186
Infineon BSP170PH6327XTSA1 - Caractéristiques techniques
| Fet Type: | P-Ch |
| Drain-to-Source Voltage [Vdss]: | 60V |
| Drain-Source On Resistance-Max: | 300mΩ |
| Rated Power Dissipation: | 1.8|W |
| Qg Gate Charge: | 10nC |
| Style d'emballage : | SOT-223 (TO-261-4, SC-73) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1000 par Reel
Style d'emballage :
SOT-223 (TO-261-4, SC-73)
Méthode de montage :
Surface Mount