The AIROC™ CYW4373E from Infineon is a robust Wi-Fi®/Bluetooth® wireless system-on-chip (SoC) which contains an IEEE 802.11ac Wi-Fi and dual-mode Bluetooth 5.2 radio, offering reliable and secure connectivity at data rates up to 433.3 Mbits/s.
This enables connectivity in challenging RF environments such as hospitals, factories, and shops. It offers various differentiated features, such as:
Now Laird Connectivity, a strategic Infineon Wireless Module partner, has introduced the Sterling-LWB5+ module based on the CYW4373E, providing a globally certified system solution which is easy to integrate into industrial IoT applications. The Sterling-LWB5+ is also available in a 22 mm x 30 mm M.2 card form factor.
The 12 mm x 17 mm module provides a complete implementation of Wi-Fi and Bluetooth connectivity, including power amplifier, low-noise amplifier, and an antenna system supporting antenna diversity, for reliable operation in conditions which are hostile to RF communication. Laird supplies the module with a Linux Backports package which provides broad kernel support for users of the Linux operating system.
Rated for operation over an industrial temperature range of -40°C to 85°C, the module in solder-down format can withstand vibrations and shock, making it suitable for use in harsh environments. Approvals and certificates include:
This ready-to-use module gives electronic product manufacturers a simple way to take advantage of the superior RF performance and advanced features of the CYW4373E SoC.
In addition, Laird Connectivity has recently introduced a USB adapter for the Sterling-LWB5+ module. Supplied in a compact, rugged enclosure, this provides a secure, high-performance solution for easy integration with any Linux-based system which offers an existing USB-A connection.
Kit Part Number: 453-00045-K1
The 453-00045-K1 is a development kit for the Sterling LWB5+ module with chip antenna.