Infineon & Laird Connectivity — AIROC CYW4373E System-on-Chip
Infineon
Laird Connectivity

Infineon AIROC CYW4373E System-on-Chip

Integrated wireless module provides easy way to implement Wi-Fi+Bluetooth connectivity

The AIROC™ CYW4373E from Infineon is a robust Wi-Fi®/Bluetooth® wireless system-on-chip (SoC) which contains an IEEE 802.11ac Wi-Fi and dual-mode Bluetooth 5.2 radio, offering reliable and secure connectivity at data rates up to 433.3 Mbits/s.

 

This enables connectivity in challenging RF environments such as hospitals, factories, and shops. It offers various differentiated features, such as:

  • Diverse interfaces, including SDIO, PCIe and USB hub
  • A single antenna shared between the Wi-Fi and Bluetooth radios
  • Support for antenna diversity for improved range and coverage
  • Industrial operating-temperature range

Now Laird Connectivity, a strategic Infineon Wireless Module partner, has introduced the Sterling-LWB5+ module based on the CYW4373E, providing a globally certified system solution which is easy to integrate into industrial IoT applications. The Sterling-LWB5+ is also available in a 22 mm x 30 mm M.2 card form factor.

 

The 12 mm x 17 mm module provides a complete implementation of Wi-Fi and Bluetooth connectivity, including power amplifier, low-noise amplifier, and an antenna system supporting antenna diversity, for reliable operation in conditions which are hostile to RF communication. Laird supplies the module with a Linux Backports package which provides broad kernel support for users of the Linux operating system.

 

Rated for operation over an industrial temperature range of -40°C to 85°C, the module in solder-down format can withstand vibrations and shock, making it suitable for use in harsh environments. Approvals and certificates include:

  • FCC
  • IC
  • CE
  • RCM
  • MIC
  • Bluetooth interoperability

This ready-to-use module gives electronic product manufacturers a simple way to take advantage of the superior RF performance and advanced features of the CYW4373E SoC.

 

In addition, Laird Connectivity has recently introduced a USB adapter for the Sterling-LWB5+ module. Supplied in a compact, rugged enclosure, this provides a secure, high-performance solution for easy integration with any Linux-based system which offers an existing USB-A connection.

Infineon — AIROC CYW4373E System-on-Chip

Features

  • Dual-band 2.4 GHz/5 GHz radio
  • Supports 802.11b/g/n/ac Wi-Fi networking
  • Supports Bluetooth 5.2
    • Basic rate
    • Enhanced data rate
    • Bluetooth Low Energy
  • Bluetooth/Wi-Fi co-existence
  • WPA3 security

Applications

  • Industrial IoT connectivity
  • Rugged handheld devices
  • Battery-powered medical equipment
  • Industrial IoT sensors

Development Kit

Kit Part Number: 453-00045-K1

The 453-00045-K1 is a development kit for the Sterling LWB5+ module with chip antenna.

Infineon — AIROC CYW4373E System-on-Chip

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