High-frequency RF designs need controlled attenuation while minimizing size, noise, loss variation, and thermal concentration around the signal path. The ATS-FD series provides miniature surface-mount chip attenuators for wireless communication equipment and RF modules. Operating from dc to 55GHz with a 50Ω impedance, the series supports compact signal paths requiring stable attenuation at high frequencies.
A face-down mounting structure places the attenuation circuit close to the board connection, helping shorten the signal path. The signal line is also sandwiched between ground, which supports heat dissipation and helps suppress noise in dense RF layouts.
The internal circuit supports attenuation values from 0dB to 10dB. Depending on attenuation value and size, the ATS-FD series uses thru, pi, or dual-pi circuit configurations.
Two package sizes address different layout and power requirements. The ATS1005-FD suits compact 0402 layouts and is rated at 32mW, while the ATS2012-FD provides an 0805 option rated at 100mW.
Attenuation tolerance and VSWR are specified across three frequency ranges up to 55GHz, allowing designers to evaluate performance as operating frequency increases. The series supports an operating-temperature range of -40°C to 125°C.
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