STMicroelectronics — ASM330LHHX Automotive Grade System-in-Package (SiP)

STMicroelectronics ASM330LHHX

A 6-axis module for automotive that keeps learning

The STMicroelectronics ASM330LHHX is a 6-axis system-in-package (SiP). This device features a 3-axis digital accelerometer and a 3-axis digital gyroscope, an extended temperature range of up to +105 °C and a design that’s made to address most automotive non-safety applications.

This family of MEMS sensor modules by STMicroelectronics takes full advantage of the tried and true processes of the company for manufacturing micromachined accelerometer and gyroscopes for the automotive and consumer markets. With this experience as backup, the ASM330LHHX is AEC-Q100 compliant and industrialized through a dedicated MEMS production flow that guarantees automotive grade reliability and standards.

With all parts tested and all design aspects optimized, the ASM330LHHX guarantees reliability, a superior output stability, extremely low noise and full data synchronization to the benefit of sensor-assisted applications.

Features

• AEC-Q100 qualified
• Extended temperature range from -40 to +105 °C
• Embedded compensation for high stability over temperature
• Android compliant
• Accelerometer user-selectable full scale up to ±16 g
• Extended gyroscope range from ±125 to ±4000 dps
• Dual operating modes: high-performance and low-power mode
• I²C, MIPI I3CSM, and SPI serial interfaces
• Six-channel synchronized output to enhance accuracy of dead-reckoning algorithms
• Programmable finite state machine
• Machine learning core
• Smart programmable interrupts
• Embedded 3 KB FIFO available to underload host processor
• ECOPACK and RoHS compliant