Wireless IC combines Wi-Fi 6/6E and Bluetooth Low Energy connectivity

April 9, 2026

The AIROC™ CYW55513 IC from Infineon offers superior coverage thanks to a large link budget and various range-extending features, supporting smart control functions in lighting, building automation, and consumer devices.

The reliable, high-performance AIROC CYW5551x chipsets combine Wi-Fi® 6/6E and a Bluetooth® 6.0 wireless connectivity controller system.  

 

Offering best-in-class Wi-Fi performance, the AIROC CYW55513 also allows for sensors and lights to be connected over a Bluetooth Low Energy link at very long range. This enables, for instance, intelligent sensors to provide for smart control of lights when the host system senses the presence or absence of people in a conference room, alongside conference bridge functionality.  

 

The CYW55513 provides up to 24dBm of transmit power, and sensitivity down to -101.5dBm, while supporting Wi-Fi 6/6E range-improving features including long guard intervals, a long OFDM symbol, and dual-carrier modulation. The chipset is available for ordering by distribution customers as part of integrated Wi-Fi/Bluetooth modules from Murata, Embedded Artists, Ezurio and u-blox.  

 

The high-performance LBEE5HY2FY-922 Type 2FY module from Murata is supplied in a very small package which facilitates integration into size- and power-sensitive applications, including industrial applications operating at temperatures up to 85°C. The Type 2FY module is also available in an M.2 form factor from Embedded Artists, in the EAR00511 or EAR00512 modules.  

 

The Ezurio Sona™ IF513 module integrates a power amplifier and low-noise amplifier with a 1 x 1 MU-SISO antenna for reliable connectivity in harsh RF environments. The module is supplied with a Linux Backports package for excellent compatibility with the Linux® operating system.  

 

The u-blox MAYA-W3 module is available in versions with a PCB antenna, a u.fl connector, or antenna pins. The surface-mount package has a footprint of just 10.4mm x 14.3mm.  

 

Three members of the CYW5551x family 

The CYW55513 is a member of the AIROC CYW5551x chipset, consisting of the tri-band 2.4GHz/5GHz/6GHz CYW55513, the dual-band CYW55512, and the single-band CYW55511. All three chips provide an IEEE 802.11ax-compliant Wi-Fi 6/6E media access controller, baseband and radio, alongside a Bluetooth/Bluetooth Low Energy (LE) 6.0 radio sub-system. 

 

Bluetooth system control is performed by a 192 MHz Arm® Cortex®-M33 processor. The chips support Bluetooth Classic and Bluetooth LE functions running in hosted/controller mode, or in the embedded mode in which the chip relieves the host processor of the burden of running Bluetooth application functions.  

 

The CYW5551x supports various Bluetooth features including LE Audio, LE2 data transfers at 2Mbits/s, LE1 at 1Mbit/s, Bluetooth Low Energy long-range (LR) mode, and periodic advertising extensions. 

Features

  • Network offload power saving features 
  • WPA2 and WPA3 security 
  • SDIO and GSPI Wi-Fi host interfaces 
  • UART and SDIO Bluetooth host interfaces 
  • 39 GPIOs 
  • Security features:  
    • Secure boot 
    • Encryption 
    • Authentication
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Applications

  • Smart home equipment 
  • IoT and industrial IoT devices 
  • IP cameras and video doorbells 
  • Smart door locks 
  • Appliances 
  • Smart watches 
  • Smart glasses 
  • Sensors 
  • Smart speakers 
  • Smart lighting 

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Infineon CYW55513

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