The MLPF-WL-0xD3 ICs provide a ready-made impedance matching network and filter which optimize the RF performance of STMicroelectronics STM32WL3 sub-GHz wireless microcontroller modules. The MLPF-WL-0xD3 chips are tuned to optimize RF performance at either the 826 to 958MHz or the 413 to 479MHz frequency bands.
Different versions of these matching network/filter chips are configured to work alongside the STM32WL3 module operating in either high-power output mode, up to 20dBm, or low-power mode down to 10dBm. The filter provides deep rejection of harmonics.
Use of these highly integrated chips simplifies the design of sub-GHz radio circuits and improves performance. The sensitivity of the RF system is reduced to temperature swings, fabrication process variation, and thickness, providing better stability compared to matching network circuits composed of discrete components, or LTCC modules.
Use of these integrated matching network chips enables RF system designers to reduce the size of the board and minimize component count.
The MLPF-WL-0xD3 chips use ST integrated passive device (IPD) technology on a non-conductive glass substrate to provide outstanding RF performance, and are supplied in a compact chip-scale package with a pitch of 0.4mm.
