Infineon has introduced the MOTIX™ TLE9954QSW40-33, a System-in-Package (SiP) designed for brushless dc (BLDC) automotive applications. The SiP integrates a 32-bit Arm® Cortex®-M23 core, local interconnect network (LIN) transceiver, a three-phase gate driver, and six OptiMOS™ 7 power MOSFETs inside a single package. Combining all of these features into one package enables 2-layer PBCs and allows designers to reduce board footprint by up to 40% compared to standard designs.
The TLE9954QSW40-33 is part of the MOTIX™ family of low-voltage motor control solutions, and can be used to control automotive auxiliary drives such as pumps or fans, or compact smart motors, with one example being seat adjustment.
Several peripherals are included to support BLDC applications:
Integrated Arm® TrustZone® technology provides hardware-based isolation of safety- and security-relevant functions for automotive applications. With AEC-Q100 Grade 0 qualification and support for ISO 26262 up to ASIL B, the MOTIX TLE9954QSW40-33 meets the reliability and safety requirements of modern automotive motor control applications.
Measuring just 9.5mm x 9mm in a LIQFN-58-1 package, the SiP has an operating temperature range of -40°C to 175°C suitable for harsh conditions often found inside automobiles.
Designers using the SiP can get a head start using the MOTIX™ TLE994_5x Software Development Kit (SDK) which includes a peripheral driver library as well as boot, startup, and example code. The SDK is supported by Infineon Device Configurator plus Arm® Keil and IAR IDEs for a development experience which is familiar to many engineers.
Part Number: Z8F80908363 REF_MINI_CMFRT_SIP
The REF-MINI-CMFRT-SIP is a miniature comfort motor control reference design, by Infineon, for highly space-constrained automotive brushless direct current (BLDC) motor applications. It is designed around the MOTIX™ TLE9954QSW40-33 System-in-Package (SiP), which integrates a 32-bit motor control microcontroller unit (MCU) with a 3-phase bridge driver. The board targets 100W loads from a 12V battery supply and is positioned for applications such as BLDC seat adjustment, auxiliary water pumps, oil pumps, fans and other compact comfort or thermal management motor systems.
The design measures just 30mm x 17mm x 10mm and uses double-sided component placement on a 4-layer printed circuit board (PCB) to minimize board area. It includes an OptiMOS™ 7 IAUZN04S7N026 MOSFET for reverse polarity protection and a XENSIV™ TLE5572 tunnel magnetoresistance (TMR) current sensor, which enables current measurement through the bridge without a shunt resistor. The board also supports local interconnect network (LIN) communication and provides debug connectors for flashing and microcontroller communication. Infineon highlights the design for space, cost and thermal optimisation, with electrical, thermal and electromagnetic compatibility (EMC) measurements included in the user guide.
Sign up for access to exclusive development boards, an essential tool for many innovative design projects.
*Available to pre-qualified EMEA customers only.
