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Manufacturer Part #
PIC32MX270F512L-50I/PT
32 Bit MCU, 512KB Flash, 64KB RAM, 50 MHz, 100 Pin, USB, 3 Comp, CTMU, RTCC
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:119 per Tray | ||||||||||
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Microchip PIC32MX270F512L-50I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:15 January 2025 (date code: 253)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Microchip has released a new Errata for the PIC32MX1XX/2XX/5XX 64/100-pin Family Silicon Errata and Data Sheet Clarification of devices.Description of Change:Added Silicon Issue 19. Module:Flash: RTSP Date Document Changes Effective: 23 Sep 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the PIC32MX1XX/2XX/5XX 64/100-pin Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: Updated the silicon revision B0 details to all tables and silicon issues.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 12 Apr 2022
Final Notice: Qualification of 100L TQFP (12x12x1mm) with 240x240 Lead-Frame Paddle size at ASAC (UDG) assembly site. Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI and ASAC assembly sites.Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Available Packaging
Package Qty:
119 per Tray