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Manufacturer Part #
PIC32MX430F064L-I/PF
32 Bit MCU, 64KB Flash, 16KB RAM, 100 MHz - 100 TQFP
Microchip PIC32MX430F064L-I/PF - Product Specification
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Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Microchip has released a new Errata for the PIC32MX330/350/370/430/450/470 Family Silicon Errata and Data Sheet Clarification of devices.Description of Change:The following updates were performed in this revision.? The note was clarified in silicon issue 11. Module: ?USB?? Added silicon issue 26. Module: ?Flash: RTSP?Reason for Change: To Improve Productivity
Part Status:
Available Packaging
Package Qty:
90 per Tray