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Référence fabricant
RN4870-I/RM130
Bluetooth BLE Module, ASCII Interface, Shielded Antenna,12X22mm, Industrial Temp
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :88 par Tray Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip RN4870-I/RM130 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
***FPCN109722 UPDATE***Revision History:December 17, 2024: Issued initial notification.January 24, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on February 24, 2025.Description of Change:Qualification of MTAI as an additional final test site for selected BM70, BM71, RN4870, RN4871 device families available in 16L (11.5x9x2.1 mm), 33L (12x22mm), 30L (12x15mm) and 17L (8x6x1.6 mm) Module packages.
Description of Change:Qualification of MTAI as an additional final test site for selected BM70, BM71,RN4870, RN4871 device families available in 16L (11.5x9x2.1 mm), 33L (12x22mm), 30L (12x15mm)and 17L (8x6x1.6 mm) Module packages.Reason for Change: To improve on-time delivery performance by qualifying MTAI as an additional finaltest site.V
Microchip has released a new Datasheet for the RN4870/71 Data Sheet of devices.Notification Status: FinalDescription of Change:? Added Bluetooth SIG/QDID information in Features and Section 11.0 ?Regulatory Approval?? Updated Figure 4-9? Updated Moisture Sensitivity Level in Table 2-1Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 14 Dec 2023
Microchip has released a new Datasheet for the RN4870/71 Bluetooth Low Energy Module Data Sheet of devices. Notification Status: FinalDescription of Change: Updated (included Voltage Monitor/Reset IC on the reference circuit) Figure 5-2, Figure 5-3, Figure 5-4 and Figure 5-5.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 31 May 2023
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=RN4870-I/RM130&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--wireless-rf--rf-modules-solutions--proprietary/rn4870-i-rm130-microchip-8106093
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=RN4870-I/RM130&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--wireless-rf--rf-modules-solutions--proprietary/rn4870-i-rm130-microchip-8106093
Microchip RN4870-I/RM130 - Caractéristiques techniques
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The RN4870 Bluetooth Low Energy module is designed for easy implementation into a broad range of applications. It delivers up to 2.5x throughput improvement and more secure connections vs. Bluetooth 4.1 based products. Developers can easily interface to the device via a standard UART interface, available on most Microcontrollers and Processors.
The RN4870 has a completely integrated Bluetooth software stack, and offers a shielded regulatory certified version with built-in antenna. Developers are freed from the complexities of Bluetooth Software and RF development and can simply utilize the RN4870 as a wireline replacement. Perfect for IoT (Internet of Things) applications, when interfaced to a Bluetooth Low Energy enabled smartphone or Bluetooth Internet Gateway, applications can be monitored, controlled and updated from anywhere in the world.
Emballages disponibles
Qté d'emballage(s) :
88 par Tray
Méthode de montage :
Surface Mount
