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Référence fabricant
MCP1826T-2502E/DC
MCP1826 Series 1 A 2.5 V Fixed Output Surface Mount LDO Regulator - SOT-223-5
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :4000 par Reel Style d'emballage :SOT-223-5 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP1826T-2502E/DC - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 112912 ***Revision History: March 07, 2025: Issued initial notification.March 10, 2025: Re-issued initial notification to update the Qualification Plan file.May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.November 11, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 10, 2025. Updated affected parts list to add MCP1824ST1202E/DBVAO, MCP1824T1802E/OTVAO, MCP1825S-5002E/DBVAO and MCP1725-5002E/SNVAO catalog part numbers (CPN). Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families of 132k and 133k technologies available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 10 December 2025 (date code: 2550)
******FPCN111387 UPDATE/LOCATION CHANGE******Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.**March 10, 2025: Re-issued initial notification to update the Qualification Plan file.**May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP1826T-2502E/DC&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--linear-regulators/mcp1826t-2502e-dc-microchip-3004700
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP1826T-2502E/DC&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--linear-regulators/mcp1826t-2502e-dc-microchip-3004700
Microchip MCP1826T-2502E/DC - Caractéristiques techniques
| Input Voltage-Min: | 2.3V |
| Input Voltage-Max: | 6V |
| Output Voltage Fixed: | 2.5V |
| Dropout Voltage-Max: | 400mV |
| Output Current-Max: | 1A |
| Style d'emballage : | SOT-223-5 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP1826T-2502E/DC is a Part of MCP1826 Series 1000 mA Low Dropout (LDO) linear regulator that provides high current and low output voltages. It has an operating temperature ranging between between -40 to 125°C and is available in SOT223-5 SMT Package.
Features:
- 1000 mA Output Current Capability
- Input Operating Voltage Range: 2.3 V to 6.0 V
- Adjustable Output Voltage Range: 0.8 V to 6.0 V (MCP1826 only)
- Standard Fixed Output Voltages:- 0.8V, 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
- Other Fixed Output Voltage Options Available upon Request
- Low Dropout Voltage: 250 mV Typical at 1000 mA
- Typical Output Voltage Tolerance: 0.5%
- Stable with 1.0 μF Ceramic Output Capacitor
- Fast Response to Load Transients
- Low Supply Current: 120 μA (typical)
- Low Shutdown Supply Current: 0.1 μA (typical) (MCP1826 only)
- Fixed Delay on Power Good Output (MCP1826 only)
- Short Circuit Current Limiting and,overtemperature Protection
- TO-263-5 (DDPAK-5), TO-220-5, SOT-223-5 Package Options (MCP1826)
- TO-263-3 (DDPAK-3), TO-220-3, SOT-223-3 Package Options (MCP1826S).
Applications:
- High-Speed Driver Chipset Power
- Networking Backplane Cards
- Notebook Computers
- Network Interface Cards
- Palmtop Computers
- 2.5 V to 1.X V Regulators
Emballages disponibles
Qté d'emballage(s) :
4000 par Reel
Style d'emballage :
SOT-223-5
Méthode de montage :
Surface Mount