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Manufacturer Part #
TC377TX96F300SABKXUMA1
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1000 per
LFBGA-292
Surface Mount
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COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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Detailed change informationSubject MC-ISAR AURIX AS4xx Release Notes Addendum V21.0 affecting products TC3xxDescription Old - RNA Version 20.0 New- RNA Version 21.0Reason Update of the Release Notes Addendum due to new known issues.
Detailed change informationSubject HSM_MEM Release Notes Addendum V9.0 affecting products TC3xxReason Update of the Release Notes Addendum due to new known issuesDescription Old - Release Notes Addendum Version 8.0New- Release Notes Addendum Version 9.0
Subject Errata sheet V2.7 affecting products TC37xEXT_AB.Description:Old - Errata Sheet V2.6 New- Errata Sheet V2.7Reason Update of Errata Sheet from version V2.6 to V2.7.
Description:Old - Not applicable (initial version)New- Errata Advance Information TC3xx_Errata_Advance_Info_2025_10_v1_0Reason:Functional Problems, Application Hints, Documentation Updates
Detailed change informationSubject MC-ISAR AURIX AS4xx Release Notes Addendum V20.0 affecting products TC3xx.Reason Update of the Release Notes Addendum due to new known issues.Description Old- Release Notes Addendum Version 19.0New- Release Notes Addendum Version 20.0
Description of Change:AURIX? TC3xx errata advance information ? 2025-08Reason for Change:Functional Problems, Application Hints, Documentation Updates
Detailed change informationSubject Errata sheet V2.6 affecting products TC37xEXT_AB.Reason Update of Errata Sheet from version V2.5 to V2.6Description OldErrata Sheet V2.5NewErrata Sheet V2.6
Description of Change:TC3xx: Update of Safety Package Release NotesReason for Change:Update post release of Errata (TC39xBC, TC38xAD are outside of scope for this INF)
Description:TEST FLOW: Move of all or part of electrical wafer test and/or final test to a different test site.Old:Ardentec Corporation Taiwan, Hsinchu Industrial Park. AND Infineon Technologies Dresden GmbH & Co. KG, Dresden, GermanyNew:Ardentec Corporation Taiwan, Hsinchu Industrial Park. AND Infineon Technologies Dresden GmbH & Co. KG, Dresden, Germany AND King Yuan Electronics Corporation, (KYEC) Hsinchu, Taiwan AND Tera-Probe, Inc., (TPJ), Kumamoto, JapanIntended start of delivery [1] - 2025-11-17Last order date (LOD) [2] - 2025-11-17Last delivery date (LDD) [3] - 2026-05-18
Description of Change:AURIX? TC3xx errata advance information ? 2025-05Reason for Change:Functional Problems, Application Hints, Documentation Updates
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
The Infineon AURIX™ family's TC37xTX Microcontroller (MCU) featur...