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Référence fabricant
ATMEGA328PB-MU
20MHZ, QFN/MFL, IND TEMP, GREEN 5 V
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :490 par Tray Style d'emballage :VQFN-32 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2331 | ||||||||||
Microchip ATMEGA328PB-MU - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of MTAI as an additional assembly site for selected ATMEGA8xxx, ATMEGA16xxx, ATMEGA32xxx andATMEGA48xxx Atmel device families available in 48L VQFN (6x6x0.9mm) and 32L VQFN (5x5x0.9mm) packages.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly site.
***June 12, 2024: Issued cancellation notice***Description of Change:This qualification was originally performed to qualify MPHL as an additional final test site for ATMEGA328PB-MU, ATMEGA328PB-MN, ATMEGA328PB-MNR, and ATMEGA328PB-MUR catalog part numbers available in 32L VQFN (5x5x0.9mm) package.Reason for Change:Microchip has decided to not qualify MPHL as an additional final test site for ATMEGA328PB-MU, ATMEGA328PB-MN, ATMEGA328PB-MNR, and ATMEGA328PB-MUR catalog part numbers available in 32L VQFN (5x5x0.9mm) package.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATMEGA1608, ATmega168PB, ATMEGA3208, ATmega328PB, ATMEGA4808, ATmega48PB, ATMEGA808, ATmega88PB and AVR16EB32 device families available in 32L VQFN (5x5x0.9mm) package at MP3A assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MP3A assembly site.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATMEGA1608, ATmega168PB, ATMEGA3208, ATmega328PB, ATMEGA4808, ATmega48PB, ATMEGA808, ATmega88PB and AVR16EB32 device families available in 32L VQFN (5x5x0.9mm) package at MP3A assembly site.Pre and Post Change Summary: See attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MP3A assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:February 2024Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Revision History:September 05, 2023: Issued initial notification.October 11, 2023: Issued final notification. Attached the Qualification Report. Modified wire material changes for MTAI and MMT from Au to Au/CuPdAu. Include AVR16EB32-I/RXB and AVR16EB32T-I/RXB catalog part numbers in the affected parts list. Provided estimated first ship date to be on November 15, 2023.PCN Status:Final NotificationPCN Type:Manufacturing Change Description of Change:Qualification of MP3A as an additional assembly site for selected ATMEGAxx and AVR16EB32xx device families available in 32L VQFN (5x5x0.9mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MP3A as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:November 15, 2023 (date code: 2346)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=ATMEGA328PB-MU&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--microcontrollers--8-bit/atmega328pb-mu-microchip-9112353
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=ATMEGA328PB-MU&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--microcontrollers--8-bit/atmega328pb-mu-microchip-9112353
Microchip ATMEGA328PB-MU - Caractéristiques techniques
| Family Name: | ATmega |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 32kB |
| RAM Size: | 2kB |
| Speed: | 20MHz |
| No of I/O Lines: | 27 |
| InterfaceType / Connectivity: | I2C/SPI/USART |
| Peripherals: | Brown-out Detect/POR/PWM |
| Number Of Timers: | 5 |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 8-chx10-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | VQFN-32 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
490 par Tray
Style d'emballage :
VQFN-32
Méthode de montage :
Surface Mount