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Manufacturer Part #
MCO50-16IO1
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10 per Tube
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Description:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag. This improvement applies to power discrete parts that are currently packed in Tube only.Effective date : Jan 2, 2026
Description:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag. This improvement applies to power discrete parts that are currently packed in Tube only.Form, fit, function changes : No changeEffective date : Jan 2, 2026
*****FPCN95821 UPDATE*****Description of Change:As part of our strong commitment in providing technical support and information, Littelfuse would like to provide additional details regarding ceramic thickness change belonging to PCN#ESW490-47 ? Thyristor & Diode SOT-227.
Littelfuse would like to notify you that we have qualified alternative Epoxy Molding Compound (EMC) material for various IXYS Brand Thyristor & Diode Discrete Packages to serve the Business Continuity Plan (BCP).Package types includes : TO-262, TO-3P, TO-247, SOT227, TO-268, TO-263, TO-220.All affected IXYS Brand Thyristor & Diode Discrete products have been fully qualified in accordance with established performance and reliability criteria using alternative EMC. The attached pages summarized the qualification results. Full qualification data and/or samples will be available upon request.Form, fit, function changes: No Fit/Form/Function change with alternative EMC.Effective date: August 10th, 2024
This is a updated declaration letter associated to ESW490-40 - IXYS Thy & Diode I4Pac&GUFP Package; ESW490-44 - IXYS Thy & Diode TO247_ISO247_PLUS247_ISOPLUS247Package; ESW490-47 - IXYS Thy & Diode SOT-227 Package; PCN # ESW490-48 ? IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer. Littelfuse will change the MOQ/MDQ/DU for IXYS Power Thyristor & Diode products aligning to manufacture requirement.
This is a updated declaration letter associated to ESW490-40 - IXYS Thy & Diode I4Pac&GUFP Package; ESW490-44 -IXYS Thy & Diode TO247_ISO247_PLUS247_ISOPLUS247Package; ESW490-47 - IXYS Thy & Diode SOT-227 Package; PCN # ESW490-48 ? IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer. Littelfuse will change the MOQ/MDQ/DU for IXYS Power Thyristor & Diode products aligning to manufacture requirement. Detail affected part number list refer to Appendix.
Notification of IXYS Power Thyristor & Diode TO-263/SOT-227/ TO247_ISO247_PLUS247_ISOPLUS247 PackagingMOQ Change_Aug-17'2023This is a declaration letter associated to PCN # ESW490-48 ? IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer/ ESW490-47 ? Thyristor&Diode SOT-227 Packaging Location Transfer/ESW490-44 ?Thyristor&Diode TO247_ISO247_PLUS247_ISOPLUS247 Packaging Location Transfer, Littelfuse will change the MOQ for IXYS Power Thyristor & Diode products aligning to manufacture requirement. Detail affected part number listrefer to Appendix attached.There will be no change on product fit, form, function. Following is the package info for your reference.TO-263:50 units per tube28 tubes per box (Total: 1,400 units)SOT-227:10 units per tube10 tubes per box (Total: 100 units)TO-247:30 units per tube10 tubes per box (Total: 300 units)
This is a declaration letter associated to PCN # ESW490-48 ? IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer/ ESW490-47 ? Thyristor&Diode SOT-227 Packaging Location Transfer/ESW490-44 ?Thyristor&Diode TO247_ISO247_PLUS247_ISOPLUS247 Packaging Location Transfer, Littelfuse will change the MOQ for IXYS Power Thyristor & Diode products aligning to manufacture requirement. Detail affected part number listrefer to Appendix.There will be no change on product fit, form, function.
Littelfuse would like to notify you that we will transfer our backend assembly process of Thyristor & Diode products SOT-227 Package to our new inhouse assembly factory in Lipa, Philippines. This brand-new assembly factory is to fulfill our strategy to invest in state-of-the-art power semiconductor assembly capabilities to dramatically improve our service levels to customers. Our target is to build this factory as a world class facility with automated, error proof processes to meet the highest quality standards. Contact our local Sales team in case you would like to understand more about this new factory. Below is the detail changes associate with this Assembly Location change: 1) Silicon Die: No change 2) Backend Assembly Bill of Materials: No change 3) Backend Assembly Process Flow: Some part numbers change from Pad type to Padless type. Refer to PCN report. 4) Backend Assembly Equipment: Equal or better 5) Marking & Labeling: Yes.
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
