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Référence fabricant
2-1761605-7
AMP-LATCH 20 Position 2.54 mm Dual Row Through-Hole Right Angle Pin Header
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| Nom du fabricant: | TE Connectivity | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1600 par Box Méthode de montage :Through Hole | ||||||||||
| Code de date: | |||||||||||
TE Connectivity 2-1761605-7 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
General Product Description:AMP-LATCH Low Profile HeadersDescription of ChangesTo whom it may concern. These products will be under EC due to Supplier manufacturing location change ; and for product improvement, it will change the packing and material with TE s 100% test finished to improve the quality. We will ask for your understanding for this improvement change. During this period , supply chain will be impacted the production , please be advised that the lead times may be extended
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=2-1761605-7&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/p/interconnect--pin-and-socket-connectors--header-plug-board-mount/2-1761605-7-te-connectivity-9898644
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=2-1761605-7&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/p/interconnect--pin-and-socket-connectors--header-plug-board-mount/2-1761605-7-te-connectivity-9898644
TE Connectivity 2-1761605-7 - Caractéristiques techniques
| No of Positions: | 20 |
| Pitch: | 2.54 mm |
| Style/Orientation: | Right Angle Header/Plug |
| Termination: | Solder |
| Type: | Pin Headers |
| Méthode de montage : | Through Hole |
Fonctionnalités et applications
Features:
- Connector
- LOw Profile
- AMP Latch Product line
- Number of Positions 20
- Number of Rows are 2
- Pin Header
- Thermoplastic-GF Housing Material
- Gold (30) Contact ,Plating Mating Area
Emballages disponibles
Qté d'emballage(s) :
1600 par Box
Méthode de montage :
Through Hole