Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Pays sélectionné
Référence fabricant
MCP4706A1T-E/CH
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3000 par Reel
SOT-23-6 (SOT-26)
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
CCB 7276 Final NoticeDescription of Change: Qualification palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421, MCP4725, MCP4726, MCP4706, MCP4716, MCP9510, MCP47DA1, MCP4023, MCP4022, MCP4013, MCP4012, and MCP3425 device families available in 6L SOT-23 package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 07 March 2025 (date code: 2510)Revision History: November 13, 2024: Issued initial notification.January 31, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on March 07, 2025.
Description of Change: Qualification palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421, MCP4725, MCP4726, MCP4706, MCP4716, MCP9510, MCP47DA1, MCP4023, MCP4022, MCP4013, MCP4012, and MCP3425 device families available in 6L SOT-23 package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421xxx, MCP3425Axx, MCP401xx, MCP402xx, MCP4706Axx, MCP4716Axx, MCP4725Axx, MCP4726Axx, MCP47DA1T, and MCP9510xx device families available in 6L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status:In ProgressEstimated First Ship Date:February 16, 2023 (date code: 2307)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421xxx, MCP3425Axx, MCP401xx, MCP402xx, MCP4706Axx, MCP4716Axx, MCP4725Axx, MCP4726Axx, MCP47DA1T, and MCP9510xx device families available in 6L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
