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Manufacturer Part #
MCP3914A1-E/MV
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73 per Tube
UQFN-40
Surface Mount
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PCN Information:
Product Category: 16-Bit Microcontrollers, 32-Bit Microcontrollers, 8-Bit Microcontrollers, Analog Multiplexer/Switch ICs, Analog to Digital Converters, CAN Controller, CAN Controller With Integrated Transceiver, Capacitive Touch Sensors, Current And Power Measurement Ics, Digital Signal Controllers, Digital to Analog Converters, Gate Drivers and Motor Drivers, Hybrid Controllers, Interface- Serial Peripherals, Power Management - PWM Controllers, SST Power Amplifiers, Ultrasound Transmitter Pulser ICs, Wireless Modules, Wireless Power And USB-PD ControllerNotification Subject: CCB 8425 Initial Notice: Qualification of 558-2C31 as a new die attach material for selected various device families available in various packages at NSEB (UTL-1) assembly site.Description of Change: Qualification of 558-2C31 as a new die attach material for selected various device families available in various packages at NSEB (UTL-1) assembly site.Pre and Post Summary Changes: See attached SPCN documentReason for Change: To improved manufacturability by qualifying 558-2C31 as a new die attach material at NSEB (UTL-1) site.Estimated Qualification Completion Date: November 2026
*** Cancellation of PCN 114805 ***Revision History:July 30, 2025: Issued initial notification.January 30, 2026: Issued cancellation notification.PCN Status: Cancellation NotificationDescription of Change: This qualification was initially performed to qualify palladium coated copper with gold flash (CuPdAu) as a new wire material and 558-2C31 as a new die attach material for MCP3914A1T-E/MVVAO, MCP3914A1-E/MV, MCP3914A1T-E/MV, MCP3913A1-E/MV, MCP3913A1T-E/MV, MCP3913A1T-E/MVVAO, MCP3914BA1T-E/MV, MCP3913BA1-E/MV, MCP3913BA1T-E/MV, and MCP3914BA1-E/MV catalog part numbers (CPN) available in 40L UQFN (5x5x0.5mm) package at NSEB assembly site.Reason for Change: Microchip has decided not to qualify palladium coated copper with gold flash (CuPdAu) as a new wire material and 558-2C31 as a new die attach material for MCP3914A1T E/MVVAO, MCP3914A1-E/MV, MCP3914A1T-E/MV, MCP3913A1-E/MV, MCP3913A1T-E/MV, MCP3913A1T-E/MVVAO, MCP3914BA1T-E/MV, MCP3913BA1-E/MV, MCP3913BA1T-E/MV, and MCP3914BA1-E/MV catalog part numbers (CPN) available in 40L UQFN (5x5x0.5mm) package at NSEB assembly site.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and 558-2C31 as a new die attach material for MCP3914A1T-E/MVVAO, MCP3914A1-E/MV, MCP3914A1T-E/MV, MCP3913A1-E/MV, MCP3913A1T-E/MV, MCP3913A1T-E/MVVAO, MCP3914BA1T-E/MV, MCP3913BA1-E/MV, MCP3913BA1T-E/MV, and MCP3914BA1-E/MV catalog part numbers (CPN) available in 40L UQFN (5x5x0.5mm) package at NSEB assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material and 558-2C31 as a new die attach material.Estimated Qualification Completion Date: January 2026
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