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Manufacturer Part #
APT75GP120JDQ3
Download the CAD models for this product. Learn more about SnapMagic.
10 per Tube
SOT-227
Chassis Mount
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PCN Information:
Description of Change:Microchip has released a new Document for the IGBT Datasheet V(BR)CES Test Condition Errata of devices. Initial Release.Reason for Change: To improve productivityChange Implementation Status: CompleteDate Document Changes Effective: 22 Jan 2026
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.***Issued final notification. Provided estimated first ship date to be on June 29, 2024.
Microchip has released a new Datasheet for the APT75GP120JDQ3 1200 V 75 A MOS 7 PT IGBT with DQ Diode SOT-227 Datasheet of devices. Description of Change:Document migrated from Microsemi template to Microchip template; Assigned Microchip literature number DS-00005343A, which replaces the previous Microsemi literature number 050-7458.
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.