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Manufacturer Part #
FF450R12ME3BOSA1
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10 per Tray
Module
Chassis Mount
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Description:Product discontinuationReason: Product portfolio rationalizationLast order date: 2026-08-15Last delivery date: 2027-02-15
Description:Introduction of an additional wafer production site with 12? wafer diameter for 1200V IGBT3 (E3) technology.Reason:Capacity extension and increasing security of supply 1200V IGBT3 (E3) technology
Detailed change informationSubject:Optimization of the bond layout for EconoDUALTM3 modules.Description:Old Pin 9 (Auxiliary Collector)NewPin 9 (Auxiliary Collector)Reason Continuous improvement for product reliability and process stabilityIntended start of delivery: From 2025 August onwards, during the ramp-up phase deliveries from both variants are possible.
Description:Introduction of optimized EconoDUAL?3 frame designReason:Standardization of the frame for EconoDUAL?3 product portfolio, based on an optimized design.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.