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Manufacturer Part #
IPP026N10NF2SAKMA1
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50 per
TO-220-3 (TO-220AB)
Through Hole
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Detailed change information:Subject Phase out of Kyocera KEG300 mold compound for several assembly locations and change of lead finish from tin dip to electroplating at Tijuana, Mexico for dedicated TO220-3 & TO247-3 products.Reason:To ensure continuity of mold compound supply due to Kyocera KEG300 end of life and to further ensure our product performance with lead-free electroplating finish
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Infineon's StrongIRFET™ 2 power MOSFET 100V features low RDS(on) of 2.6 mOhm, addressing a broad range of applications from low- to high-switching frequency.
Summary of Features •Broad availability from distribution partners •Excellent price/performance ratio •Ideal for high- and low-switching frequency •Industry standard footprint through-hole package •High current rating •Capable of wave-soldering
Benefits •Multi-vendor compatibility •Right-fit products •Supports a wide variety of applications •Standard pinout allows for drop-in replacement •Increased current carrying capability •Ease of manufacturing
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.