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SI3493BDV-T1-BE3
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3000 per Reel
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Description of Change: To meet the increasing demand for commercial Power MOSFET products, Vishay Siliconix announces the qualification of wafer BGBM process (Backside-Grind and Backside-Metallization) for commercial Low-Voltage Power MOSFETs at in-house Siliconix Philippines Inc.(SPI) facility in Binan, Philippines.Reason for Change: Capacity Expansion
Description of Change: To meet increasing demand for commercial Power MOSFET products, Vishay Siliconix announces the qualification of wafer back-grind and back-metallization (BGBM) on select commercial Power MOSFET in SOT-23 and TSOP6 packages at Prosperity Power Technology Inc. (ProPowertek, previously IST).ProPowertek, founded at the Hsinchu Science Park in Nov?20, aims to provide customers with engineering services for the center- and backend wafer making process, and is devoted to leading the world in this market. ProPowertek is focusing on wafer thinning engineering, front side metal (FSM), backside grinding backside metal (BGBM), and IGBT back-end Turnkey solution in the local IC industry chain. ProPowertek has achieved ISO9001, ISO14001, ISO45001, and IATF16949 certifications for quality management systems. Classification of Change: Manufacturing Capacity ExpansionExpected Influence on Quality/Reliability/Performance: There will be no effect on quality, reliability, performance, and the minimum/maximum values in the datasheet.Vishay Brand(S): Vishay SiliconixTime Schedule:Start Shipment Date: Mon May 22, 2023
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
