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Manufacturer Part #
SQJ180EP-T1_GE3
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3000 per Reel
POWERPAK-SO-8L
Surface Mount
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Description of Change: To maximize wafer fabrication efficiency and fully utilize all available in-house tools the process flow for the part numbers will have one process step performed at our Vishay Newport Limited wafer fab. All other steps will still be performed at our original Vishay Itzehoe Germany facility.The overall wafer process flow is identical, and the tools used in both facilities are identical as are the tool setups and configurations. In summary:•Same tool type, with configuration copied from our existing tool•Frame and chamber are of the same type and design•Use of the same process media and chemistry•Finished wafers produced with the new combined fab flow will be identical to existing production•The final packaged parts will be identical and indistinguishable from current production•There are no changes to any elements of the design or final testing•Parts using this combined fab flow have been fully qualified to the same standards as the original parts.Reason for Change: Capacity ExpansionStart Shipment Date: Monday May 11, 2026
Description of Change: The Mosfet wafer plating process for automotive products will move to a new building within the same Laguna Technopark.Classification of Change: In order to increase capacity Vishay Siliconix has moved the Philippines wafer plating facility in a larger building with the same equipment, same process and same personnel.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.