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Manufacturer Part #
DSPIC33CDV256MP206-E/M9
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40 per Tube
VGQFN-64
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
*** Update of DPCN 109558 ***February 19, 2026: Issued final notification. Provided estimated first ship date to be on February 27, 2026. Added column "Change (Yes/No)" in the pre and post change table. Description of Change: Qualification of CVB715BUA as a new mold compound material for selected dsPIC33CDVC256MP506and dsPIC33CDVC128MP506 device families available in 64L VGQFN (9x9x0.927) package.Reason for Change: To improve manufacturability by qualifying CVB715BUA as a new molding compound material.Estimated Qualification Completion Date: 31 March 2026Estimated First Ship Date: 27 February 2026 (date code: 2609)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Microchip has released a new Document for the dsPIC33CDV(C)XXXMP506 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at (C)XXXMP506 Family Silicon Errata and Data Sheet Clarification.Description of Change:Added data sheet clarifications 2. through 17.
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
Microchip's dsPIC® DSC-based integrated motor drivers incorporate...
